Temperature-aware microarchitecture

Authors:
Kevin Skadron;Mircea R. Stan;Wei Huang;Sivakumar Velusamy;Karthik Sankaranarayanan;David Tarjan
Affiliations:
University of Virginia, Charlottesville, VA;University of Virginia, Charlottesville, VA;University of Virginia, Charlottesville, VA;University of Virginia, Charlottesville, VA;University of Virginia, Charlottesville, VA;University of Virginia, Charlottesville, VA
Venue:
Proceedings of the 30th annual international symposium on Computer architecture
Year:
2003

Citing 13
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Proceedings of the 48th Design Automation Conference
Token3D: reducing temperature in 3d die-stacked CMPs through cycle-level power control mechanisms

Euro-Par'11 Proceedings of the 17th international conference on Parallel processing - Volume Part I
Throughput Maximization for Intel Desktop Platform under the Maximum Temperature Constraint

GREENCOM '11 Proceedings of the 2011 IEEE/ACM International Conference on Green Computing and Communications
Predictive Model-Based Thermal Management for Network Applications

Proceedings of the 2011 ACM/IEEE Seventh Symposium on Architectures for Networking and Communications Systems
Full-chip runtime error-tolerant thermal estimation and prediction for practical thermal management

Proceedings of the International Conference on Computer-Aided Design
Fuzzy control for enforcing energy efficiency in high-performance 3D systems

Proceedings of the International Conference on Computer-Aided Design
Characterizing the lifetime reliability of manycore processors with core-level redundancy

Proceedings of the International Conference on Computer-Aided Design
Speed scaling to manage temperature

STACS'05 Proceedings of the 22nd annual conference on Theoretical Aspects of Computer Science
Coupled power and thermal simulation with active cooling

PACS'03 Proceedings of the Third international conference on Power - Aware Computer Systems
Low-overhead core swapping for thermal management

PACS'04 Proceedings of the 4th international conference on Power-Aware Computer Systems
Finding extreme behaviors in microprocessor workloads

Transactions on High-Performance Embedded Architectures and Compilers IV
A novel software solution for localized thermal problems

ISPA'06 Proceedings of the 4th international conference on Parallel and Distributed Processing and Applications
RELOCATE: register file local access pattern redistribution mechanism for power and thermal management in out-of-order embedded processor

HiPEAC'10 Proceedings of the 5th international conference on High Performance Embedded Architectures and Compilers
Recent thermal management techniques for microprocessors

ACM Computing Surveys (CSUR)
3D IC floorplanning: Automating optimization settings and exploring new thermal-aware management techniques

Microelectronics Journal
Reliability-aware platform optimization for 3D chip multi-processors

The Journal of Supercomputing
Sustainable multi-core architecture with on-chip wireless links

Proceedings of the great lakes symposium on VLSI
An information-theoretic framework for optimal temperature sensor allocation and full-chip thermal monitoring

Proceedings of the 49th Annual Design Automation Conference
Optimizing energy efficiency of 3-D multicore systems with stacked DRAM under power and thermal constraints

Proceedings of the 49th Annual Design Automation Conference
Recovery-based design for variation-tolerant SoCs

Proceedings of the 49th Annual Design Automation Conference
Thermal-aware real-time task scheduling for three-dimensional multicore chip

Proceedings of the 27th Annual ACM Symposium on Applied Computing
Thermal management of a many-core processor under fine-grained parallelism

Euro-Par'11 Proceedings of the 2011 international conference on Parallel Processing
Temperature-aware floorplanning via geometric programming

Mathematical and Computer Modelling: An International Journal
Expediating IP lookups with reduced power via TBM and SST supernode caching

Computer Communications
Spatial and temporal thermal characterization of stacked multicore architectures

ACM Journal on Emerging Technologies in Computing Systems (JETC)
Thermal-aware sampling in architectural simulation

Proceedings of the 2012 ACM/IEEE international symposium on Low power electronics and design
Fan-speed-aware scheduling of data intensive jobs

Proceedings of the 2012 ACM/IEEE international symposium on Low power electronics and design
Multi-level simultaneous multithreading scheduling to reduce the temperature of register files

Concurrency and Computation: Practice & Experience
XPoint cache: scaling existing bus-based coherence protocols for 2D and 3D many-core systems

Proceedings of the 21st international conference on Parallel architectures and compilation techniques
Power agnostic technique for efficient temperature estimation of multicore embedded systems

Proceedings of the 2012 international conference on Compilers, architectures and synthesis for embedded systems
Lifetime improvement through runtime wear-based task mapping

Proceedings of the eighth IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
COOL: control-based optimization of load-balancing for thermal behavior

Proceedings of the eighth IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
SPECO: Stochastic Perturbation based Clock tree Optimization considering temperature uncertainty

Integration, the VLSI Journal
Architectural implications of spatial thermal filtering

Integration, the VLSI Journal
On the fundamentals of leakage aware real-time DVS scheduling for peak temperature minimization

Journal of Systems Architecture: the EUROMICRO Journal
Cross-Level compositional reliability analysis for embedded systems

SAFECOMP'12 Proceedings of the 31st international conference on Computer Safety, Reliability, and Security
Fine-grained hardware/software methodology for process migration in MPSoCs

Proceedings of the International Conference on Computer-Aided Design
Developing Domain-Knowledge Evolutionary Algorithms for Network-on-Chip Application Mapping

Microprocessors & Microsystems
Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors

ACM Transactions on Design Automation of Electronic Systems (TODAES)
Energy-efficient multicore chip design through cross-layer approach

Proceedings of the Conference on Design, Automation and Test in Europe
3D-MMC: a modular 3D multi-core architecture with efficient resource pooling

Proceedings of the Conference on Design, Automation and Test in Europe
Exploring memory consistency for massively-threaded throughput-oriented processors

Proceedings of the 40th Annual International Symposium on Computer Architecture
Cooperative boosting: needy versus greedy power management

Proceedings of the 40th Annual International Symposium on Computer Architecture
Reliable on-chip systems in the nano-era: lessons learnt and future trends

Proceedings of the 50th Annual Design Automation Conference
Exploiting process variability in voltage/frequency control

IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Neighbor-aware dynamic thermal management for multi-core platform

DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
Runtime power estimator calibration for high-performance microprocessors

DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
Analysis and runtime management of 3D systems with stacked DRAM for boosting energy efficiency

DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
Thermal-aware energy minimization for real-time scheduling on multi-core systems

ACM SIGBED Review - Special Issue on the Work-in-Progress (WiP) session of the 33rd IEEE Real-Time Systems Symposium (RTSS'12)
CoMETC: Coordinated management of energy/thermal/cooling in servers

ACM Transactions on Design Automation of Electronic Systems (TODAES)
Dynamic programming-based runtime thermal management (DPRTM): An online thermal control strategy for 3D-NoC systems

ACM Transactions on Design Automation of Electronic Systems (TODAES)
Cost-effective lifetime and yield optimization for NoC-based MPSoCs

ACM Transactions on Design Automation of Electronic Systems (TODAES)
Register allocation for embedded systems to simultaneously reduce energy and temperature on registers

ACM Transactions on Embedded Computing Systems (TECS)
Throughput maximization for periodic real-time systems under the maximal temperature constraint

ACM Transactions on Embedded Computing Systems (TECS) - Special Section ESFH'12, ESTIMedia'11 and Regular Papers
Fast and accurate thermal modeling and simulation of manycore processors and workloads

Microelectronics Journal
Design space exploration of thermal-aware many-core systems

Journal of Systems Architecture: the EUROMICRO Journal
Compact thermal modeling for packaged microprocessor design with practical power maps

Integration, the VLSI Journal
Design configuration selection for hard-error reliable processors via statistical rules

Microprocessors & Microsystems

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Abstract

With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processor-level techniques that can regulate operating temperature when the package's capacity is exceeded. Evaluating such techniques, however, requires a thermal model that is practical for architectural studies.This paper describes HotSpot, an accurate yet fast model based on an equivalent circuit of thermal resistances and capacitances that correspond to microarchitecture blocks and essential aspects of the thermal package. Validation was performed using finite-element simulation. The paper also introduces several effective methods for dynamic thermal management (DTM): "temperature-tracking" frequency scaling, localized toggling, and migrating computation to spare hardware units. Modeling temperature at the microarchitecture level also shows that power metrics are poor predictors of temperature, and that sensor imprecision has a substantial impact on the performance of DTM.