Tracing the Thermal Behavior of ICs
IEEE Design & Test
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
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Power consumption and heat dissipation become key elements in the field of high-end integrated circuits, especially those used in mobile and high-speed applications, due to their increase of transistor count and clock frequencies. Dynamic thermal management strategies have been proposed and implemented in order to mitigate heat dissipation. However, there is a lack of a tool that can be used to evaluate DTM strategies and thermal response of real life systems. Therefore, in this paper we introduce and define for the first time the concept of thermal benchmark software as a software concept (and tool) for run-time system level thermal characterization.