Thermal imaging and measurement techniques for electronic materials and devices
Proceedings of the fifth European conference on Electron and optical beam testing of electronic devices
Electro-thermal and logi-thermal simulation of VLSI designs
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
CMOS sensors for on-line thermal monitoring of VLSI circuits
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Realistic and efficient simulation of electro-thermal effects in VLSI circuits
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
3D thermal-ADI: an efficient chip-level transient thermal simulator
Proceedings of the 2003 international symposium on Physical design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Three-dimensional Integrated Circuit Design
Three-dimensional Integrated Circuit Design
Energy characterization of mobile devices and applications using power-thermal benchmarks
Microelectronics Journal
Power-thermal profiling of software applications
Microelectronics Journal
Microprocessor thermal benchmark
ICCOMP'06 Proceedings of the 10th WSEAS international conference on Computers
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Scaling down of ICs and the increased packaging densities resulted in increased concern about thermal issues during the design of ICs and their packages. In this paper the advances in the thermal design, measuring and testing methods of ICs are discussed. After presenting the state-of-the-art in the thermal and electro-thermal simulation and measurement methods the idea and methodological questions of the Design for Thermal Testability (DfTT) are discussed. Thermal characterization problems of IC packages are reviewed shortly.