Statistical estimation of average power dissipation in sequential circuits
DAC '97 Proceedings of the 34th annual Design Automation Conference
On thermal effects in deep sub-micron VLSI interconnects
Proceedings of the 36th annual ACM/IEEE Design Automation Conference
Analysis and optimization of thermal issues in high-performance VLSI
Proceedings of the 2001 international symposium on Physical design
Proceedings of the 2001 international symposium on Physical design
Low Power Digital CMOS Design
Tracing the Thermal Behavior of ICs
IEEE Design & Test
ISQED '00 Proceedings of the 1st International Symposium on Quality of Electronic Design
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Interconnect thermal modeling for accurate simulation of circuit timing and reliability
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Fault Simulation Model for i{DDT} Testing: An Investigation
VTS '04 Proceedings of the 22nd IEEE VLSI Test Symposium
A thermal-driven floorplanning algorithm for 3D ICs
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Thermal-driven multilevel routing for 3-D ICs
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Defect Simulation Methodology for iDDT Testing
Journal of Electronic Testing: Theory and Applications
A stochastic local hot spot alerting technique
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Thermal-driven analog placement considering device matching
Proceedings of the 46th Annual Design Automation Conference
Run-time adaptable on-chip thermal triggers
Proceedings of the 16th Asia and South Pacific Design Automation Conference
Thermal-aware bus-driven floorplanning
Proceedings of the 17th IEEE/ACM international symposium on Low-power electronics and design
Thermal signature: a simple yet accurate thermal index for floorplan optimization
Proceedings of the 48th Design Automation Conference
Proceedings of the ACM/SIGDA international symposium on Field Programmable Gate Arrays
Bus-driven floorplanning with thermal consideration
Integration, the VLSI Journal
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Recent studies show that the nonuniform thermal distribution on the substrate and interconnects has impact on the circuit reliability and performance. Hence three-dimensional (3-D) thermal analysis is crucial to analyze these effects. In this paper, we present and develop an efficient 3-D transient thermal simulator based on the alternating direction implicit (ADI) method for large scale temperature estimation problems. Our simulator, 3D Thermal-ADI, not only has a linear runtime and memory requirement, but also is unconditionally stable. Detailed analysis of the 3-D nonhomogeneous cases and boundary conditions for on-chip VLSI applications are introduced and presented. Extensive experimental results show that our algorithm is not only orders of magnitude faster than the traditional thermal simulation algorithms, but is also highly accurate and memory efficient. The temperature profile of steady state can be reached in few iterations. The software is avaiable on the web [1].