Standard cell placement for even on-chip thermal distribution
ISPD '99 Proceedings of the 1999 international symposium on Physical design
Proceedings of the 37th Annual Design Automation Conference
An efficient method for hot-spot identification in ULSI circuits
ICCAD '99 Proceedings of the 1999 IEEE/ACM international conference on Computer-aided design
Proceedings of the 2001 international symposium on Physical design
Analysis of non-uniform temperature-dependent interconnect performance in high performance ICs
Proceedings of the 38th annual Design Automation Conference
3D thermal-ADI: an efficient chip-level transient thermal simulator
Proceedings of the 2003 international symposium on Physical design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Efficient full-chip thermal modeling and analysis
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Electrothermal analysis and optimization techniques for nanoscale integrated circuits
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
TAPHS: thermal-aware unified physical-level and high-level synthesis
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Thermal-driven multilevel routing for 3-D ICs
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Accurate Thermal Analysis Considering Nonlinear Thermal Conductivity
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
A high efficiency full-chip thermal simulation algorithm
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
A logarithmic full-chip thermal analysis algorithm based on multi-layer Green's function
Proceedings of the conference on Design, automation and test in Europe: Proceedings
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Power model validation through thermal measurements
Proceedings of the 34th annual international symposium on Computer architecture
Measuring performance, power, and temperature from real processors
Proceedings of the 2007 workshop on Experimental computer science
Measuring performance, power, and temperature from real processors
ecs'07 Experimental computer science on Experimental computer science
The road to 3D EDA tool readiness
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
N-version temperature-aware scheduling and binding
Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design
Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Full-chip thermal analysis for the early design stage via generalized integral transforms
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
A new technique of multi-layer thermal analysis for VLSI chips
MMACTEE'07 Proceedings of the 9th WSEAS international conference on Mathematical methods and computational techniques in electrical engineering
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
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In this paper, we present a new chip-level electrothermal timing simulator for CMOS VLSI circuits. Given the chip layout, the packaging specification, and the periodic input signal pattern, it finds the on-chip steady-state temperature profile and the resulting circuit performance. A tester chip has been designed for verification of ILLIADS-T, and very good agreement between simulation and experiment was found. Using this electrothermal simulator, temperature-dependent reliability and timing problems of VLSI circuits can be accurately identified