Numerical Recipes in C++: the art of scientific computing
Numerical Recipes in C++: the art of scientific computing
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
ISQED '04 Proceedings of the 5th International Symposium on Quality Electronic Design
Temperature-aware microarchitecture: Modeling and implementation
ACM Transactions on Architecture and Code Optimization (TACO)
Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
A thermal-driven floorplanning algorithm for 3D ICs
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Wire congestion and thermal aware 3D global placement
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Proceedings of the 43rd annual Design Automation Conference
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits
Proceedings of the 43rd annual Design Automation Conference
Thermal-Aware 3D IC Placement Via Transformation
ASP-DAC '07 Proceedings of the 2007 Asia and South Pacific Design Automation Conference
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IC thermal simulation and modeling via efficient multigrid-based approaches
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
High-Efficiency Green Function-Based Thermal Simulation Algorithms
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Stochastic thermal simulation considering spatial correlated within-die process variations
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
NUMANA: a hybrid numerical and analytical thermal simulator for 3-D ICs
Proceedings of the Conference on Design, Automation and Test in Europe
A network-flow based algorithm for power density mitigation at post-placement stage
Proceedings of the Conference on Design, Automation and Test in Europe
An efficient method for analyzing on-chip thermal reliability considering process variations
ACM Transactions on Design Automation of Electronic Systems (TODAES)
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The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns during modern IC design. This paper presents an accurate and fast analytical full-chip thermal simulator for early-stage temperature-aware chip design. By using the generalized integral transforms (GIT), an accurate formulation is derived to estimate the temperature distribution of full-chip with a truncated set of spatial bases which only needs very small truncation points. Then, we develop a fast Fourier transform like evaluating algorithm to efficiently evaluate the derived formulation. Experimental results confirm that the proposed GIT-based analyzer can achieve an order of magnitude speedup compared with a highly efficient Green's function-based thermal simulator. Finally, we propose a 3-D IC thermal simulator and demonstrate its efficiency and accuracy.