An explicit RC-circuit delay approximation based on the first three moments of the impulse response
DAC '96 Proceedings of the 33rd annual Design Automation Conference
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Temperature-aware microarchitecture: Modeling and implementation
ACM Transactions on Architecture and Code Optimization (TACO)
Journal of Computational Physics
Asymptotic probability extraction for non-normal distributions of circuit performance
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
WITHIN DIE THERMAL GRADIENT IMPACT ON CLOCK-SKEW: ANEW TYPE OF DELAY-FAULT MECHANISM
ITC '04 Proceedings of the International Test Conference on International Test Conference
Karhunen-Loève approximation of random fields by generalized fast multipole methods
Journal of Computational Physics - Special issue: Uncertainty quantification in simulation science
Prediction of leakage power under process uncertainties
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Analysis and modeling of CD variation for statistical static timing
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
A general framework for spatial correlation modeling in VLSI design
Proceedings of the 44th annual Design Automation Conference
Dynamic thermal clock skew compensation using tunable delay buffers
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Stochastic thermal simulation considering spatial correlated within-die process variations
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Statistical modeling and analysis of chip-level leakage power by spectral stochastic method
Integration, the VLSI Journal
Proceedings of the 47th Design Automation Conference
Robust spatial correlation extraction with limited sample via L1-norm penalty
Proceedings of the 16th Asia and South Pacific Design Automation Conference
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Full-chip thermal analysis for the early design stage via generalized integral transforms
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Improved Thermal Tracking for Processors Using Hard and Soft Sensor Allocation Techniques
IEEE Transactions on Computers
Distribution of noncentral indefinite quadratic forms in complex normal variables
IEEE Transactions on Information Theory
ISAC: Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Statistical Thermal Profile Considering Process Variations: Analysis and Applications
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Power yield analysis under process and temperature variations
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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This work provides an efficient statistical electrothermal simulator for analyzing on-chip thermal reliability under process variations. Using the collocation-based statistical modeling technique, first, the statistical interpolation polynomial for on-chip temperature distribution can be obtained by performing deterministic electrothermal simulation very few times and by utilizing polynomial interpolation. After that, the proposed simulator not only provides the mean and standard deviation profiles of on-chip temperature distribution, but also innovates the concept of thermal yield profile to statistically characterize the on-chip temperature distribution more precisely, and builds an efficient technique for estimating this figure of merit. Moreover, a mixed-mesh strategy is presented to further enhance the efficiency of the developed statistical electrothermal simulator. Experimental results demonstrate that (1) the developed statistical electrothermal simulator can obtain accurate approximations with orders of magnitude speedup over the Monte Carlo method; (2) comparing with a well-known cumulative distribution function estimation method, APEX [Li et al. 2004], the developed statistical electrothermal simulator can achieve 215× speedup with better accuracy; (3) the developed mixed-mesh strategy can achieve an order of magnitude faster over our baseline algorithm and still maintain an acceptable accuracy level.