NUMANA: a hybrid numerical and analytical thermal simulator for 3-D ICs

Authors:
Yu-Min Lee;Tsung-Heng Wu;Pei-Yu Huang;Chi-Ping Yang
Affiliations:
National Chiao Tung University, Taiwan;National Chiao Tung University, Taiwan;Industrial Technology Research Institute, Taiwan;National Chiao Tung University, Taiwan
Venue:
Proceedings of the Conference on Design, Automation and Test in Europe
Year:
2013

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Abstract

By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.