Full-chip thermal analysis for the early design stage via generalized integral transforms
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Design and CAD for 3D integrated circuits
Proceedings of the 45th annual Design Automation Conference
Automated module assignment in stacked-Vdd designs for high-efficiency power delivery
ACM Journal on Emerging Technologies in Computing Systems (JETC)
ThermalScope: multi-scale thermal analysis for nanometer-scale integrated circuits
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Addressing thermal and power delivery bottlenecks in 3D circuits
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Multiscale thermal analysis for nanometer-scale integrated circuits
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Thermal analysis of multiprocessor SoC applications by simulation and verification
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Full-chip thermal analysis for the early design stage via generalized integral transforms
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
A new technique of multi-layer thermal analysis for VLSI chips
MMACTEE'07 Proceedings of the 9th WSEAS international conference on Mathematical methods and computational techniques in electrical engineering
Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs
Proceedings of the 17th IEEE/ACM international symposium on Low-power electronics and design
Fast thermal analysis on GPU for 3D-ICs with integrated microchannel cooling
Proceedings of the International Conference on Computer-Aided Design
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Foundations and Trends in Electronic Design Automation
3D transient thermal solver using non-conformal domain decomposition approach
Proceedings of the International Conference on Computer-Aided Design
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Proceedings of the Conference on Design, Automation and Test in Europe
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The ever-increasing power consumption and packaging density of integrated systems creates on-chip temperatures and gradients that can have a substantial impact on performance and reliability. While it is conceptually understood that a thermal equivalent circuit can be constructed to characterize the temperature gradients across the chip, direct and iterative solutions of the corresponding three-dimensional (3-D) equations are often intractable for a full-chip analysis. Integrated circuit (IC)-specific multigrid (MG) techniques for fast chip level thermal steady-state and transient simulation are proposed. This approach avoids an explicit construction of the matrix problem that is intractable for most full-chip problems. Specific MG treatments are proposed to cope with the strong anisotropy of the full-chip thermal problem that is created by the vast difference in material thermal properties and chip geometries. Importantly, this paper demonstrates that only with careful thermal modeling assumptions and appropriate choices for grid hierarchy, MG operators, and smoothing steps across grid points can a full-chip thermal problem be accurately and efficiently analyzed. This paper further speeds up the large thermal transient simulations by incorporating reduced-order thermal models that can be efficiently extracted under the same MG framework. The experiments carried out in this work have shown that the proposed methodology provides sufficient efficiency in both runtime and memory usage