Thermal via placement in 3D ICs
Proceedings of the 2005 international symposium on Physical design
IBM Journal of Research and Development - POWER5 and packaging
Thermomechanical modeling of 3D electronic packages
IBM Journal of Research and Development
Thermal modeling for 3D-ICs with integrated microchannel cooling
Proceedings of the 2009 International Conference on Computer-Aided Design
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
Proceedings of the Conference on Design, Automation and Test in Europe
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
Fast thermal analysis on GPU for 3D-ICs with integrated microchannel cooling
Proceedings of the International Conference on Computer-Aided Design
Cell-level placement for improving substrate thermal distribution
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IC thermal simulation and modeling via efficient multigrid-based approaches
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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3D integration becomes promising to be able to continue the system integration trend due to short TSV interconnection used for stacked dies. This paper proposes an efficient transient thermal modeling method using non-conformal domain decomposition approach for 3D stacked ICs and systems. To alleviate the problem arising from the feature scale difference between stacked dies as well as package and PCB, the 3D system is divided into many subdomains. Each subdomain (die, package or PCB) can be meshed independently using different gridding based on its feature size and therefore the required meshing cells are greatly reduced compared to conventional method such as finite element or finite volume method. The heat flow continuity between subdomains is captured using the introduced interface basis functions. In addition, the proposed compact micro-fluidic model based on finite volume method is proved to be compatible with the finite element model for solid medium based on introduced forced convection boundary and energy conservation. The experimental results show the proposed method offers up to 5x unknown reduction and 91x speed-up compared to conventional finite element method.