Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Breaking Down the Memory Wall for Scalable Microprocessor Platforms
Proceedings of the 13th International Conference on Parallel Architectures and Compilation Techniques
IBM Journal of Research and Development - POWER5 and packaging
Challenges and opportunities in the post single-thread-processor era
Proceedings of the 15th international conference on Parallel architectures and compilation techniques
Miss Rate Prediction Across Program Inputs and Cache Configurations
IEEE Transactions on Computers
Interconnects in the third dimension: design challenges for 3D ICs
Proceedings of the 44th annual Design Automation Conference
Placement of thermal vias in 3-D ICs using various thermal objectives
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
3D transient thermal solver using non-conformal domain decomposition approach
Proceedings of the International Conference on Computer-Aided Design
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Development of complex electronic packages requires a judicious combination of experimentation and modeling. Fabrication costs of electronic packaging prototypes can be prohibitive; therefore, the building of effective virtual prototypes provides an important challenge for the modeling community. Fortunately, finite-element modeling (FEM) has become sufficiently mature to allow technologists to develop reliable insights into the thermal and mechanical integrity of proposed structures. For modeling to be leveraged as an effective means of avoiding thermally related mechanical problems, the diversity in size scale found in three-dimensional electronic packages must be carefully considered and addressed. Employing three distinct examples, we summarize our experience and insights in applying FEM in order to make informed decisions in the early stages of product package research and development.