Thermal and Power Integrity Based Power/Ground Networks Optimization
Proceedings of the conference on Design, automation and test in Europe - Volume 2
Compact thermal modeling for temperature-aware design
Proceedings of the 41st annual Design Automation Conference
The need for a full-chip and package thermal model for thermally optimized IC designs
ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design
EFFICIENT THERMAL SIMULATION FOR RUN-TIME TEMPERATURE TRACKING AND MANAGEMENT
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Efficient full-chip thermal modeling and analysis
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Interconnect lifetime prediction under dynamic stress for reliability-aware design
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Electrothermal analysis and optimization techniques for nanoscale integrated circuits
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
On-chip thermal gradient analysis and temperature flattening for SoC design
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Wire congestion and thermal aware 3D global placement
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
TACO: temperature aware clock-tree optimization
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
A high efficiency full-chip thermal simulation algorithm
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Fast thermal simulation for architecture level dynamic thermal management
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Proceedings of the 2006 international symposium on Low power electronics and design
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Temperature-aware processor frequency assignment for MPSoCs using convex optimization
CODES+ISSS '07 Proceedings of the 5th IEEE/ACM international conference on Hardware/software codesign and system synthesis
Interconnect lifetime prediction for reliability-aware systems
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Thermal-aware Steiner routing for 3D stacked ICs
Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design
Buffered clock tree synthesis for 3D ICs under thermal variations
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Temperature control of high-performance multi-core platforms using convex optimization
Proceedings of the conference on Design, automation and test in Europe
ThermalScope: multi-scale thermal analysis for nanometer-scale integrated circuits
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
A control theory approach for thermal balancing of MPSoC
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Reducing temperature variability by routing heat pipes
Proceedings of the 19th ACM Great Lakes symposium on VLSI
Accurate temperature estimation using noisy thermal sensors
Proceedings of the 46th Annual Design Automation Conference
Multiscale thermal analysis for nanometer-scale integrated circuits
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Performance and thermal-aware Steiner routing for 3-D stacked ICs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
On-chip sensor-driven efficient thermal profile estimation algorithms
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Analysis of SRAM and eDRAM cache memories under spatial temperature variations
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
A new technique of multi-layer thermal analysis for VLSI chips
MMACTEE'07 Proceedings of the 9th WSEAS international conference on Mathematical methods and computational techniques in electrical engineering
A linear-time approach for the transient thermal simulation of liquid-cooled 3d ics
CODES+ISSS '11 Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
Fast thermal analysis on GPU for 3D-ICs with integrated microchannel cooling
Proceedings of the International Conference on Computer-Aided Design
3D transient thermal solver using non-conformal domain decomposition approach
Proceedings of the International Conference on Computer-Aided Design
ACM Transactions on Design Automation of Electronic Systems (TODAES)
NUMANA: a hybrid numerical and analytical thermal simulator for 3-D ICs
Proceedings of the Conference on Design, Automation and Test in Europe
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Recent study shows that the nonuniform thermal distribution not only has an impact on the substrate but also interconnects. Hence, three-dimensional (3-D) thermal analysis is crucial to analyze these effects. In this paper, the authors present and develop an efficient 3-D transient thermal simulator based on the alternating direction implicit (ADI) method for temperature estimation in a 3-D environment. Their simulator, 3D Thermal-ADI, not only has a linear runtime and memory requirement, but also is unconditionally stable. Detailed analysis of the 3-D nonhomogeneous cases and boundary conditions for on-chip VLSI applications are introduced and presented. Extensive experimental results show that our algorithm is not only orders of magnitude faster than the traditional thermal simulation algorithms but also highly accurate and memory efficient. The temperature profile of steady state can also be reached in several iterations. This software will be released via the web for public usage.