The SimpleScalar tool set, version 2.0
ACM SIGARCH Computer Architecture News
Predictive dynamic thermal management for multimedia applications
ICS '03 Proceedings of the 17th annual international conference on Supercomputing
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
Interconnect Technology and Design for Gigascale Integration
Interconnect Technology and Design for Gigascale Integration
Circuit Level Reliability Analysis of Cu Interconnects
ISQED '04 Proceedings of the 5th International Symposium on Quality Electronic Design
Temperature-aware microarchitecture: Modeling and implementation
ACM Transactions on Architecture and Code Optimization (TACO)
The Case for Lifetime Reliability-Aware Microprocessors
Proceedings of the 31st annual international symposium on Computer architecture
Interconnect lifetime prediction under dynamic stress for reliability-aware design
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Energy conservation policies for web servers
USITS'03 Proceedings of the 4th conference on USENIX Symposium on Internet Technologies and Systems - Volume 4
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Static electromigration analysis for on-chip signal interconnects
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Thermal-aware compilation for system-on-chip processing architectures
Proceedings of the 20th symposium on Great lakes symposium on VLSI
Self-adaptive system for addressing permanent errors in on-chip interconnects
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
A low-cost fault tolerant solution targeting commercial FPGA devices
Journal of Systems Architecture: the EUROMICRO Journal
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Thermal effects are becoming a limiting factor in high-performance circuit design due to the strong temperature dependence of leakage power, circuit performance, IC package cost, and reliability. While many interconnect reliability models assume a constant temperature, this paper analyzes the effects of temporal and spatial thermal gradients on interconnect lifetime in terms of electromigration, and presents a physics-based dynamic reliability model which returns reliability equivalent temperature and current density that can be used in traditional reliability analysis tools. The model is verified with numerical simulations and reveals that blindly using the maximum temperature leads to too pessimistic lifetime estimation. Therefore, the proposed model not only increases the accuracy of reliability estimates, but also enables designers to reclaim design margin in reliability-aware design. In addition, the model is useful for improving the performance of temperature-aware runtime management by modeling system lifetime as a resource to be consumed at a stress-dependent rate.