An electromigration and thermal model of power wires for a priori high-level reliability prediction
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Circuit-Level Modeling for Concurrent Testing of Operational Defects due to Gate Oxide Breakdown
Proceedings of the conference on Design, Automation and Test in Europe - Volume 1
A Mechanism for Online Diagnosis of Hard Faults in Microprocessors
Proceedings of the 38th annual IEEE/ACM International Symposium on Microarchitecture
Autonomic Microprocessor Execution via Self-Repairing Arrays
IEEE Transactions on Dependable and Secure Computing
Design tools for reliability analysis
Proceedings of the 43rd annual Design Automation Conference
Online diagnosis of hard faults in microprocessors
ACM Transactions on Architecture and Code Optimization (TACO)
Interconnect lifetime prediction for reliability-aware systems
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Efficient computation of current flow in signal wires for reliability analysis
Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design
NBTI resilient circuits using adaptive body biasing
Proceedings of the 18th ACM Great Lakes symposium on VLSI
On-chip em-sensitive interconnect structures
Proceedings of the 12th ACM/IEEE international workshop on System level interconnect prediction
Electromigration-aware dynamic routing algorithm for network-on-chip applications
International Journal of High Performance Systems Architecture
Circuit reliability: from physics to architectures
Proceedings of the International Conference on Computer-Aided Design
Electromigration-aware routing for 3D ICs with stress-aware EM modeling
Proceedings of the International Conference on Computer-Aided Design
WiT: optimal wiring topology for electromigration avoidance
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Accurate current estimation for interconnect reliability analysis
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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With the increase in current densities, electromigration has become a critical concern in high-performance designs. Typically, electromigration has involved the process of time-domain simulation of drivers and interconnect to obtain average, root mean square (r.m.s.), and peak current values for each wire segment. However, this approach cannot be applied to large problem sizes where hundreds of thousands of nets must be analyzed, each consisting of many thousands of RC elements. The authors propose a static electromigration analysis approach. They show that the charge transfer through wire segments of a net can be calculated directly by solving a system of linear equations, derived from the nodal formulation of the circuit, thereby eliminating the need for time domain simulation. The authors account for the different possible switching scenarios that give rise to unidirectional or bidirectional current by separating the charge transfer from the rising and falling transitions and also propose approaches for modeling multiple simultaneous switching drivers. They implemented the proposed static analysis approach in an industrial electromigration analysis tool that was used on a number of industrial circuits, including a large microprocessor.