A Supernodal Approach to Sparse Partial Pivoting
SIAM Journal on Matrix Analysis and Applications
Elementary Numerical Analysis: An Algorithmic Approach
Elementary Numerical Analysis: An Algorithmic Approach
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
Proceedings of the Conference on Design, Automation and Test in Europe
Co-design of signal, power, and thermal distribution networks for 3D ICs
Proceedings of the Conference on Design, Automation and Test in Europe
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
Fast thermal analysis on GPU for 3D-ICs with integrated microchannel cooling
Proceedings of the International Conference on Computer-Aided Design
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Placement of thermal vias in 3-D ICs using various thermal objectives
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
High-Efficiency Green Function-Based Thermal Simulation Algorithms
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Explicit transient thermal simulation of liquid-cooled 3D ICs
Proceedings of the Conference on Design, Automation and Test in Europe
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Due to their compact structure, three-dimensional integrated circuits (3D ICs) present thermal dissipation issues. Integrated microchannels are emerging as a viable solution to dissipate the heat flux generated by 3D ICs. Several models have been proposed in literature to study different microchannel designs, but generally with low simulation performance. In this paper, we present an efficient model to simulate the transient thermal behaviour of 3D ICs using microchannels. This work introduces a novel low-footprint model based on adaptive discretization grids to deal with the complex geometry of 3D ICs. Additionally, we use the operator splitting method to compute the transient temperature with linear time in the number of grid cells. Our approach is compared with state-of-the art models and reports a 100x speedup while maintaining the same level of accuracy. Finally, using our methodology we demonstrate the importance of modelling the contribution to thermal dissipation of through silicon vias used for power distribution, which are usually neglected in state-of-the-art contributions.