Elementary Numerical Analysis: An Algorithmic Approach
Elementary Numerical Analysis: An Algorithmic Approach
Thread motion: fine-grained power management for multi-core systems
Proceedings of the 36th annual international symposium on Computer architecture
A linear-time approach for the transient thermal simulation of liquid-cooled 3d ics
CODES+ISSS '11 Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
Fast thermal analysis on GPU for 3D-ICs with integrated microchannel cooling
Proceedings of the International Conference on Computer-Aided Design
Accelerating thermal simulations of 3D ICs with liquid cooling using neural networks
Proceedings of the great lakes symposium on VLSI
Understanding the Thermal Implications of Multi-Core Architectures
IEEE Transactions on Parallel and Distributed Systems
Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Exploiting process variability in voltage/frequency control
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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The high heat flux and compact structure of three-dimensional circuits (3D ICs) make conventional air-cooled devices more subsceptible to overheating. Liquid cooling is an alternative that can improve heat dissipation, and reduce thermal issues. Fast and accurate thermal models are needed to appropriately dimension the cooling system at design time. Several models have been proposed to study different designs, but generally with low simulation performance. In this paper, we present an efficient model of the transient thermal behaviour of liquid-cooled 3D ICs. In our experiments, our approach is 60 times faster and uses 600 times less memory than state-of-the-art models, while maintaining the same level of accuracy.