ACM Transactions on Mathematical Software (TOMS)
A Supernodal Approach to Sparse Partial Pivoting
SIAM Journal on Matrix Analysis and Applications
An Asynchronous Parallel Supernodal Algorithm for Sparse Gaussian Elimination
SIAM Journal on Matrix Analysis and Applications
Efficient full-chip thermal modeling and analysis
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Design and Management of 3D Chip Multiprocessors Using Network-in-Memory
Proceedings of the 33rd annual international symposium on Computer Architecture
Fundamentals of Heat and Mass Transfer
Fundamentals of Heat and Mass Transfer
Interlayer cooling potential in vertically integrated packages
Microsystem Technologies - Special Issue on MicroNanoReliability 2007
Thermal modeling for 3D-ICs with integrated microchannel cooling
Proceedings of the 2009 International Conference on Computer-Aided Design
Algorithm 907: KLU, A Direct Sparse Solver for Circuit Simulation Problems
ACM Transactions on Mathematical Software (TOMS)
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
Proceedings of the Conference on Design, Automation and Test in Europe
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs
Proceedings of the 17th IEEE/ACM international symposium on Low-power electronics and design
A linear-time approach for the transient thermal simulation of liquid-cooled 3d ics
CODES+ISSS '11 Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
Convex-based thermal management for 3D MPSoCs using DVFS and variable-flow liquid cooling
PATMOS'11 Proceedings of the 21st international conference on Integrated circuit and system design: power and timing modeling, optimization, and simulation
Fuzzy control for enforcing energy efficiency in high-performance 3D systems
Proceedings of the International Conference on Computer-Aided Design
TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs
Proceedings of the 2012 ACM international symposium on International Symposium on Physical Design
Accelerating thermal simulations of 3D ICs with liquid cooling using neural networks
Proceedings of the great lakes symposium on VLSI
Design-time performance evaluation of thermal management policies for SRAM and RRAM based 3D MPSoCs
Proceedings of the great lakes symposium on VLSI
Fast poisson solvers for thermal analysis
ACM Transactions on Design Automation of Electronic Systems (TODAES) - Special section on verification challenges in the concurrent world
Proceedings of the 49th Annual Design Automation Conference
Spatial and temporal thermal characterization of stacked multicore architectures
ACM Journal on Emerging Technologies in Computing Systems (JETC)
Integration, the VLSI Journal
3D transient thermal solver using non-conformal domain decomposition approach
Proceedings of the International Conference on Computer-Aided Design
Predictability for timing and temperature in multiprocessor system-on-chip platforms
ACM Transactions on Embedded Computing Systems (TECS) - Special section on ESTIMedia'12, LCTES'11, rigorous embedded systems design, and multiprocessor system-on-chip for cyber-physical systems
Explicit transient thermal simulation of liquid-cooled 3D ICs
Proceedings of the Conference on Design, Automation and Test in Europe
Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
STEAM: a fast compact thermal model for two-phase cooling of integrated circuits
Proceedings of the International Conference on Computer-Aided Design
Parallel power grid analysis using preconditioned GMRES solver on CPU-GPU platforms
Proceedings of the International Conference on Computer-Aided Design
Compact thermal modeling for packaged microprocessor design with practical power maps
Integration, the VLSI Journal
Journal of Electronic Testing: Theory and Applications
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Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the barriers in interconnect scaling, offering an opportunity to continue the CMOS performance trends for the next decade. However, from a thermal perspective, vertical integration of high-performance ICs in the form of 3D stacks is highly demanding since the effective areal heat dissipation increases with number of dies (with hotspot heat fluxes up to 250W/cm2) generating high chip temperatures. In this context, inter-tier integrated microchannel cooling is a promising and scalable solution for high heat flux removal. A robust design of a 3D IC and its subsequent thermal management depend heavily upon accurate modeling of the effects of liquid cooling on the thermal behavior of the IC during the early stages of design. In this paper we present 3D-ICE, a compact transient thermal model (CTTM) for the thermal simulation of 3D ICs with multiple inter-tier microchannel liquid cooling. The proposed model is compatible with existing thermal CAD tools for ICs, and offers significant speed-up (up to 975x) over a typical commercial computational fluid dynamics simulation tool while preserving accuracy (i.e., maximum temperature error of 3.4%). In addition, a thermal simulator has been built based on 3D-ICE, which is capable of running in parallel on multicore architectures, offering further savings in simulation time and demonstrating efficient parallelization of the proposed approach.