Fundamentals of Heat and Mass Transfer
Fundamentals of Heat and Mass Transfer
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
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Two-phase liquid cooling of computer chips via microchannels etched directly on silicon dies is a potential long-term solution to enable continued integration of high-performance multiprocessors. Two-phase cooling refers to the heat removal via evaporation of a refrigerant flowing inside a heat sink. While possessing superior cooling properties, large-scale use of this technology in the industry is limited by the lack of thermal modeling tools that can accurately predict temperatures in a two-phase cooled IC. In this paper, we propose STEAM, a new compact thermal model for 2D/3D ICs with two-phase cooling via silicon microchannels. The accuracy of the STEAM model is validated against measurements from a real two-phase cooled IC test stack reported previously in literature. Temperatures were predicted with an average error as low as 10.2% for uniform heat fluxes and 6.9% for hotspots. Finally, the STEAM model is applied to a realistic 3D multiprocessor system-on-chip (3D MPSoC) with two-phase cooling to simulate IC temperatures and the refrigerant pumping power, demonstrating the applicability of STEAM in the early-stage design of near-future high-performance computers with two-phase cooling.