Practical methods for optimal control using nonlinear programming
Practical methods for optimal control using nonlinear programming
Interlayer cooling potential in vertically integrated packages
Microsystem Technologies - Special Issue on MicroNanoReliability 2007
Utilizing predictors for efficient thermal management in multiprocessor SoCs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
Proceedings of the Conference on Design, Automation and Test in Europe
Non-uniform micro-channel design for stacked 3D-ICs
Proceedings of the 48th Design Automation Conference
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
STEAM: a fast compact thermal model for two-phase cooling of integrated circuits
Proceedings of the International Conference on Computer-Aided Design
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While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1, 2]. These cooling-induced thermal gradients can be high enough to create undesirable stress in the ICs, undermining the structural reliability and lifetimes. In this paper, we present a novel design-time solution for the thermal gradient problem in liquid-cooled 3D Multi-Processor System-on-Chip (MPSoC) architectures. The proposed method is based on channel width modulation and provides the designers with an additional dimension in the design-space exploration. We formulate the channel width modulation as an optimal control design problem to minimize the temperature gradients in the 3D IC while meeting the design constraints. The proposed thermal balancing technique uses an analytical model for forced convective heat transfer in microchannels, and has been applied to a two tier 3D-MPSoC. The results show that the proposed approach can reduce thermal gradients by up to 31% when applied to realistic 3D-MPSoC architectures, while maintaining pressure drops in the microchannels well below their safe limits of operation.