Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Full chip leakage estimation considering power supply and temperature variations
Proceedings of the 2003 international symposium on Low power electronics and design
Reducing power density through activity migration
Proceedings of the 2003 international symposium on Low power electronics and design
Integrating dynamic thermal via planning with 3D floorplanning algorithm
Proceedings of the 2006 international symposium on Physical design
Techniques for Multicore Thermal Management: Classification and New Exploration
Proceedings of the 33rd annual international symposium on Computer Architecture
HybDTM: a coordinated hardware-software approach for dynamic thermal management
Proceedings of the 43rd annual Design Automation Conference
A fast HW/SW FPGA-based thermal emulation framework for multi-processor system-on-chip
Proceedings of the 43rd annual Design Automation Conference
Interlayer cooling potential in vertically integrated packages
Microsystem Technologies - Special Issue on MicroNanoReliability 2007
Proactive temperature balancing for low cost thermal management in MPSoCs
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Static and dynamic temperature-aware scheduling for multiprocessor SoCs
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Dynamic thermal management in 3D multicore architectures
Proceedings of the Conference on Design, Automation and Test in Europe
Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Run-time adaptable on-chip thermal triggers
Proceedings of the 16th Asia and South Pacific Design Automation Conference
A high sensitivity and process tolerant digital thermal sensing scheme for 3-D Ics
Proceedings of the 21st edition of the great lakes symposium on Great lakes symposium on VLSI
A linear-time approach for the transient thermal simulation of liquid-cooled 3d ics
CODES+ISSS '11 Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
Convex-based thermal management for 3D MPSoCs using DVFS and variable-flow liquid cooling
PATMOS'11 Proceedings of the 21st international conference on Integrated circuit and system design: power and timing modeling, optimization, and simulation
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
Fuzzy control for enforcing energy efficiency in high-performance 3D systems
Proceedings of the International Conference on Computer-Aided Design
Proceedings of the 49th Annual Design Automation Conference
Integration, the VLSI Journal
Online thermal control methods for multiprocessor systems
ACM Transactions on Design Automation of Electronic Systems (TODAES) - Special section on adaptive power management for energy and temperature-aware computing systems
Thermal prediction and adaptive control through workload phase detection
ACM Transactions on Design Automation of Electronic Systems (TODAES) - Special section on adaptive power management for energy and temperature-aware computing systems
3D transient thermal solver using non-conformal domain decomposition approach
Proceedings of the International Conference on Computer-Aided Design
Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
Analysis and runtime management of 3D systems with stacked DRAM for boosting energy efficiency
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
Hi-index | 0.00 |
Liquid cooling has emerged as a promising solution for addressing the elevated temperatures in 3D stacked architectures. In this work, we first propose a framework for detailed thermal modeling of the microchannels embedded between the tiers of the 3D system. In multicore systems, workload varies at runtime, and the system is generally not fully utilized. Thus, it is not energy-efficient to adjust the coolant flow rate based on the worst-case conditions, as this would cause an excess in pump power. For energy-efficient cooling, we propose a novel controller to adjust the liquid flow rate to meet the desired temperature and to minimize pump energy consumption. Our technique also includes a job scheduler, which balances the temperature across the system to maximize cooling efficiency and to improve reliability. Our method guarantees operating below the target temperature while reducing the cooling energy by up to 30%, and the overall energy by up to 12% in comparison to using the highest coolant flow rate.