IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Traffic- and Thermal-Aware Run-Time Thermal Management Scheme for 3D NoC Systems
NOCS '10 Proceedings of the 2010 Fourth ACM/IEEE International Symposium on Networks-on-Chip
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
Proceedings of the Conference on Design, Automation and Test in Europe
Dynamic thermal management in 3D multicore architectures
Proceedings of the Conference on Design, Automation and Test in Europe
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
Microelectronics Journal
NOCS '11 Proceedings of the Fifth ACM/IEEE International Symposium on Networks-on-Chip
Thermal-aware floorplan schemes for reliable 3D multi-core processors
ICCSA'11 Proceedings of the 2011 international conference on Computational science and its applications - Volume Part II
Token3D: reducing temperature in 3d die-stacked CMPs through cycle-level power control mechanisms
Euro-Par'11 Proceedings of the 17th international conference on Parallel processing - Volume Part I
Agent-based thermal management using real-time I/O communication relocation for 3D many-cores
PATMOS'11 Proceedings of the 21st international conference on Integrated circuit and system design: power and timing modeling, optimization, and simulation
HPC-Mesh: A Homogeneous Parallel Concentrated Mesh for Fault-Tolerance and Energy Savings
Proceedings of the 2011 ACM/IEEE Seventh Symposium on Architectures for Networking and Communications Systems
Fuzzy control for enforcing energy efficiency in high-performance 3D systems
Proceedings of the International Conference on Computer-Aided Design
Recent thermal management techniques for microprocessors
ACM Computing Surveys (CSUR)
Reliability-aware platform optimization for 3D chip multi-processors
The Journal of Supercomputing
Proceedings of the 49th Annual Design Automation Conference
Thermal-aware real-time task scheduling for three-dimensional multicore chip
Proceedings of the 27th Annual ACM Symposium on Applied Computing
Saving on cooling: the thermal scheduling problem
Proceedings of the 12th ACM SIGMETRICS/PERFORMANCE joint international conference on Measurement and Modeling of Computer Systems
Spatial and temporal thermal characterization of stacked multicore architectures
ACM Journal on Emerging Technologies in Computing Systems (JETC)
Adaptive dynamic frequency scaling for thermal-aware 3d multi-core processors
ICCSA'12 Proceedings of the 12th international conference on Computational Science and Its Applications - Volume Part IV
Thermal-aware task scheduling in 3D chip multiprocessor with real-time constrained workloads
ACM Transactions on Embedded Computing Systems (TECS) - Special issue on embedded systems for interactive multimedia services (ES-IMS)
Predictability for timing and temperature in multiprocessor system-on-chip platforms
ACM Transactions on Embedded Computing Systems (TECS) - Special section on ESTIMedia'12, LCTES'11, rigorous embedded systems design, and multiprocessor system-on-chip for cyber-physical systems
VAWOM: temperature and process variation aware wearout management in 3D multicore architecture
Proceedings of the 50th Annual Design Automation Conference
Thermal-constrained task allocation for interconnect energy reduction in 3-D homogeneous MPSoCs
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Analysis and runtime management of 3D systems with stacked DRAM for boosting energy efficiency
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
Throughput maximization for periodic real-time systems under the maximal temperature constraint
ACM Transactions on Embedded Computing Systems (TECS) - Special Section ESFH'12, ESTIMedia'11 and Regular Papers
Design space exploration of thermal-aware many-core systems
Journal of Systems Architecture: the EUROMICRO Journal
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Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked high-power density layers of 3D CMPs increase the importance and difficulty of thermal management. In this paper, we investigate the 3D CMP run-time thermal management problem and describe efficient management techniques. This paper makes the following main contributions: 1) It identifies and describes the critical concepts required for optimal thermal management, namely the methods by which heterogeneity in both workload power characteristics and processor core thermal characteristics should be exploited; and 2) it proposes an efficient proactive continuously engaged hardware and operating system thermal management technique governed by optimal thermal management polices. The proposed technique is evaluated using multiprogrammed and multithreaded benchmarks in an integrated power, performance, and temperature full-system simulation environment. We find that proactive power-thermal budgeting allows a 30% improvement in instruction throughput compared to a proactive thermal management approach that bases decisions only upon local information. The software components of the proposed thermal management technique have been implemented in the Linux 2.6.8 kernel. This source code will be publicly released. The analysis and technique developed in this paper provide a general solution for future 3D and 2D CMPs.