The SimpleScalar tool set, version 2.0
ACM SIGARCH Computer Architecture News
Wattch: a framework for architectural-level power analysis and optimizations
Proceedings of the 27th annual international symposium on Computer architecture
The Alpha 21264 Microprocessor
IEEE Micro
Energy Aware Scheduling for Distributed Real-Time Systems
IPDPS '03 Proceedings of the 17th International Symposium on Parallel and Distributed Processing
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
Temperature-aware microarchitecture: Modeling and implementation
ACM Transactions on Architecture and Code Optimization (TACO)
Interconnections in Multi-Core Architectures: Understanding Mechanisms, Overheads and Scaling
Proceedings of the 32nd annual international symposium on Computer Architecture
Implementing Caches in a 3D Technology for High Performance Processors
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Demystifying 3D ICs: The Pros and Cons of Going Vertical
IEEE Design & Test
Thermal analysis of a 3D die-stacked high-performance microprocessor
GLSVLSI '06 Proceedings of the 16th ACM Great Lakes symposium on VLSI
Dynamic instruction schedulers in a 3-dimensional integration technology
GLSVLSI '06 Proceedings of the 16th ACM Great Lakes symposium on VLSI
Die Stacking (3D) Microarchitecture
Proceedings of the 39th Annual IEEE/ACM International Symposium on Microarchitecture
Thermal-Aware 3D IC Placement Via Transformation
ASP-DAC '07 Proceedings of the 2007 Asia and South Pacific Design Automation Conference
Thermal Management for 3D Processors via Task Scheduling
ICPP '08 Proceedings of the 2008 37th International Conference on Parallel Processing
The impact of liquid cooling on 3D multi-core processors
ICCD'09 Proceedings of the 2009 IEEE international conference on Computer design
Dynamic thermal management for single and multicore processors under soft thermal constraints
Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design
Dynamic thermal management in 3D multicore architectures
Proceedings of the Conference on Design, Automation and Test in Europe
Thermal Analysis for 3D Multi-core Processors with Dynamic Frequency Scaling
ICIS '10 Proceedings of the 2010 IEEE/ACIS 9th International Conference on Computer and Information Science
System-Level Dynamic Thermal Management for High-Performance Microprocessors
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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3D integration technology can provide significant benefits of reduced interconnection delay and low power consumption in designing multi-core processors. However, the 3D integration technology magnifies the thermal challenges in multi-core processors due to high power density caused by stacking multiple layers vertically. For this reason, the 3D multi-core architecture cannot be practical without proper solutions to the thermal problems such as Dynamic Frequency Scaling(DFS). This paper investigates how the DFS handles the thermal problems in 3D multi-core processors from the perspective of the function-unit level. We also propose an adaptive DFS technique to mitigate the thermal problems in 3D multi-core processors by assigning different DFS levels to each core based on the corresponding cooling efficiency. Experimental results show that the proposed adaptive DFS technique reduces the peak temperature of 3D multi-core processors by up to 10.35°C compared to the conventional DFS technique, leading to the improved reliability.