Thermal-aware real-time task scheduling for three-dimensional multicore chip

  • Authors:
  • Ting-Hao Tsai;Ya-Shu Chen

  • Affiliations:
  • National Taiwan University of Science and Technology, Taipei, Taiwan;National Taiwan University of Science and Technology, Taipei, Taiwan

  • Venue:
  • Proceedings of the 27th Annual ACM Symposium on Applied Computing
  • Year:
  • 2012

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Abstract

Thermal management is a major design challenge in three-dimensional multicore chips. The process is complex because of the heat effect of vertically stacked cores and the difficulty of balancing performance requirements and overheating. This study proposes a thermal-aware real-time scheduling framework for three-dimensional (3D) multicore chips. The power-aware task partition and stack supervisor schemes help resolve the thermal stress produced by multiple vertically stacked cores. The proposed framework provides a quality of service guarantee under thermal constraints, and simultaneously, ensures optimal system performance. The results of a series of extensive simulations that the proposed method effectively prevents overheating without violating the quality of service guarantee.