A framework for dynamic energy efficiency and temperature management
Proceedings of the 33rd annual ACM/IEEE international symposium on Microarchitecture
ARM System-on-Chip Architecture
ARM System-on-Chip Architecture
Power optimization of real-time embedded systems on variable speed processors
Proceedings of the 2000 IEEE/ACM international conference on Computer-aided design
Design Challenges of Technology Scaling
IEEE Micro
Partition-driven standard cell thermal placement
Proceedings of the 2003 international symposium on Physical design
Power Evaluation of a Handheld Computer
IEEE Micro
Random walks in a supply network
Proceedings of the 40th annual Design Automation Conference
Predictive dynamic thermal management for multimedia applications
ICS '03 Proceedings of the 17th annual international conference on Supercomputing
Full chip leakage estimation considering power supply and temperature variations
Proceedings of the 2003 international symposium on Low power electronics and design
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
HPCA '02 Proceedings of the 8th International Symposium on High-Performance Computer Architecture
Dynamic and Aggressive Scheduling Techniques for Power-Aware Real-Time Systems
RTSS '01 Proceedings of the 22nd IEEE Real-Time Systems Symposium
Temperature-aware microarchitecture: Modeling and implementation
ACM Transactions on Architecture and Code Optimization (TACO)
Convex Optimization
Optimized Slowdown in Real-Time Task Systems
ECRTS '04 Proceedings of the 16th Euromicro Conference on Real-Time Systems
Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
Hierarchical random-walk algorithms for power grid analysis
Proceedings of the 2004 Asia and South Pacific Design Automation Conference
Thermal-Aware Task Allocation and Scheduling for Embedded Systems
Proceedings of the conference on Design, Automation and Test in Europe - Volume 2
Thermal via placement in 3D ICs
Proceedings of the 2005 international symposium on Physical design
Mapping and configuration methods for multi-use-case networks on chips
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Accurate Thermal Analysis Considering Nonlinear Thermal Conductivity
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
Contrasting a NoC and a traditional interconnect fabric with layout awareness
Proceedings of the conference on Design, automation and test in Europe: Proceedings
Exploring "temperature-aware" design in low-power MPSoCs
Proceedings of the conference on Design, automation and test in Europe: Proceedings
Techniques for Multicore Thermal Management: Classification and New Exploration
Proceedings of the 33rd annual international symposium on Computer Architecture
A fast HW/SW FPGA-based thermal emulation framework for multi-processor system-on-chip
Proceedings of the 43rd annual Design Automation Conference
A matrix synthesis approach to thermal placement
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Cell-level placement for improving substrate thermal distribution
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Frequency planning for multi-core processors under thermal constraints
Proceedings of the 13th international symposium on Low power electronics and design
Temperature control of high-performance multi-core platforms using convex optimization
Proceedings of the conference on Design, automation and test in Europe
Temperature-aware scheduling and assignment for hard real-time applications on MPSoCs
Proceedings of the conference on Design, automation and test in Europe
Guaranteed scheduling for repetitive hard real-time tasks under the maximal temperature constraint
CODES+ISSS '08 Proceedings of the 6th IEEE/ACM/IFIP international conference on Hardware/Software codesign and system synthesis
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Towards embedded runtime system level optimization for MPSoCs: on-chip task allocation
Proceedings of the 19th ACM Great Lakes symposium on VLSI
Dynamic thermal-aware scheduling on chip multiprocessor for soft real-time system
Proceedings of the 19th ACM Great Lakes symposium on VLSI
Throughput optimal task allocation under thermal constraints for multi-core processors
Proceedings of the 46th Annual Design Automation Conference
Processor speed control with thermal constraints
IEEE Transactions on Circuits and Systems Part I: Regular Papers
Proceedings of the 2009 International Conference on Computer-Aided Design
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Thermal-aware workload scheduling for energy efficient data centers
Proceedings of the 7th international conference on Autonomic computing
Energy-efficient real-time task scheduling with temperature-dependent leakage
Proceedings of the Conference on Design, Automation and Test in Europe
Performance optimal speed control of multi-core processors under thermal constraints
Proceedings of the Conference on Design, Automation and Test in Europe
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
High level event driven thermal estimation for thermal aware task allocation and scheduling
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
Run-time adaptable on-chip thermal triggers
Proceedings of the 16th Asia and South Pacific Design Automation Conference
EURASIP Journal on Embedded Systems
Thermal-aware global real-time scheduling and analysis on multicore systems
Journal of Systems Architecture: the EUROMICRO Journal
Thermal-aware system analysis and software synthesis for embedded multi-processors
Proceedings of the 48th Design Automation Conference
System-level power and timing variability characterization to compute thermal guarantees
CODES+ISSS '11 Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
Worst-case temperature analysis for different resource availabilities: a case study
PATMOS'11 Proceedings of the 21st international conference on Integrated circuit and system design: power and timing modeling, optimization, and simulation
Thermal-aware real-time task scheduling for three-dimensional multicore chip
Proceedings of the 27th Annual ACM Symposium on Applied Computing
A multi-agent framework for thermal aware task migration in many-core systems
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Modeling the effects of DFS on power consumption in hybrid chip multiprocessors
E2SC '13 Proceedings of the 1st International Workshop on Energy Efficient Supercomputing
Journal of Electronic Testing: Theory and Applications
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The increasing processing capability of Multi-Processor Systems-on-Chips (MPSoCs) is leading to an increase in chip power dissipation, which in turn leads to significant increase in chip temperature. An important challenge facing the MPSoC designers is to achieve the highest performance system operation that satisfies the temperature and power consumption constraints. The frequency of operation of the different processors and the application workload assignment play a critical role in determining the performance, power consumption and temperature profile of the MPSoC. In this paper, we propose novel convex optimization based methods that solve this important problem of temperature-aware processor frequency assignment, such that the total system performance is maximized and the temperature and power constraints are met. We perform experiments on several realistic SoC benchmarks using a cycle-accurate FPGA-based thermal emulation platform, which show that the systems designed using our methods meet the temperature and power consumption requirements at all time instances, while achieving maximum performance.