Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach

Authors:
Brent Goplen;Sachin Sapatnekar
Affiliations:
University of Minnesota, Minneapolis;University of Minnesota, Minneapolis
Venue:
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
Year:
2003

Citing 6
Cited 72

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Abstract

As the technology node progresses, thermal problems arebecoming more prominent especially in the developingtechnology of three-dimensional (3D) integrated circuits. Thethermal placement method presented in this paper uses an iterativeforce-directed approach in which thermal forces direct cells awayfrom areas of high temperature. Finite element analysis (FEA) isused to calculate temperatures efficiently during each iteration.Benchmark circuits produce thermal placements with both lowertemperatures and thermal gradients while wirelength is minimally affected.