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DAC '97 Proceedings of the 34th annual Design Automation Conference
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FPGA '99 Proceedings of the 1999 ACM/SIGDA seventh international symposium on Field programmable gate arrays
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FPL '97 Proceedings of the 7th International Workshop on Field-Programmable Logic and Applications
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Advanced manufacturing and packaging techniques are permitting a glimpse at the near-future, where wires can go in three dimensions, and ICs made in diverse processes can be assembledtogether--sandwich like--to achieve ever higher levels of integration. This article focuses on a specific CAD problem in connection with 3D ICs: how to partition, place, and wire a design subject to various constraints on power, timing, and manufacturability.