Interlaced switch boxes placement for three-dimensional FPGA architecture design

  • Authors:
  • Chun-Lung Hsu;Yu-Sheng Huang;Fong-Chao Lee

  • Affiliations:
  • Department of Electrical Engineering, National Dong Hwa University, Hualien, Taiwan, China;Department of Electrical Engineering, National Dong Hwa University, Hualien, Taiwan, China;Department of Electrical Engineering, National Dong Hwa University, Hualien, Taiwan, China

  • Venue:
  • International Journal of Circuit Theory and Applications
  • Year:
  • 2012

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Abstract

Three-dimensional (3D) field programmable gate array (FPGA) has evoked significant interest in wire-length reduction for routing requirement. However, the complex design of the 3D switch boxes will limit the performance improvement and suffer from the area efficiency problems. This paper proposed a systematic graph model (SGM) for 3D switch boxes design to simplify the design process and reduce the storage memory for path programming. An interlaced 3D switch boxes and two-dimensional (2D) switch boxes placement topology is also presented in this paper to design the 3D FPGA architecture for area efficiency purpose. The 3D place and route tool and TSMC 0.18-µm CMOS process parameters are used to support building the experimental flow for verification. Performance evaluation shows that about 50% storage memory reduction can be obtained by using the proposed SGM-based switch design approach. Additionally, compared with conventional architectures of 2D FPGA, the proposed scheme based on interlaced switch boxes placement approach can approximately achieve 20% delay-power product improvement and 43% area-delay product reduction. Copyright © 2010 John Wiley & Sons, Ltd.