Architecture and CAD for Deep-Submicron FPGAs
Architecture and CAD for Deep-Submicron FPGAs
Interconnect-power dissipation in a microprocessor
Proceedings of the 2004 international workshop on System level interconnect prediction
Design tools for 3-D integrated circuits
ASP-DAC '03 Proceedings of the 2003 Asia and South Pacific Design Automation Conference
A software-supported methodology for exploring interconnection architectures targeting 3-D FPGAs
Proceedings of the Conference on Design, Automation and Test in Europe
A Methodology and Tool Framework for Supporting Rapid Exploration of Memory Hierarchies in FPGAs
FPL '11 Proceedings of the 2011 21st International Conference on Field Programmable Logic and Applications
Interlaced switch boxes placement for three-dimensional FPGA architecture design
International Journal of Circuit Theory and Applications
Three-dimensional place and route for FPGAs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Performance Benefits of Monolithically Stacked 3-D FPGA
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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Interconnection structures in FPGAs increasingly contribute more to the delay and power consumption. Three-dimensional (3-D) chip stacking is touted as the silver bullet technology that can keep Moore's momentum and fuel the next wave of consumer electronics products. However, the benefits of such a technology have not been sufficiently explored yet. This paper introduces a novel 3-D FPGA, where logic, memory and I/O resources are assigned to different layers. Experimental results prove the efficiency of our architecture for a wide range of application domains, since we achieve average performance improvement and power saving of 30% and 10%, respectively.