Discrete-time signal processing (2nd ed.)
Discrete-time signal processing (2nd ed.)
An efficient method for hot-spot identification in ULSI circuits
ICCAD '99 Proceedings of the 1999 IEEE/ACM international conference on Computer-aided design
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Interconnect thermal modeling for accurate simulation of circuit timing and reliability
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Cell-level placement for improving substrate thermal distribution
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
EFFICIENT THERMAL SIMULATION FOR RUN-TIME TEMPERATURE TRACKING AND MANAGEMENT
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Electrothermal analysis and optimization techniques for nanoscale integrated circuits
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
Temperature-aware routing in 3D ICs
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
METS: A Metric for Electro-Thermal Sensitivity, and Its Application To FinFETs
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
A high efficiency full-chip thermal simulation algorithm
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Fast thermal simulation for architecture level dynamic thermal management
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
A logarithmic full-chip thermal analysis algorithm based on multi-layer Green's function
Proceedings of the conference on Design, automation and test in Europe: Proceedings
Temperature-aware processor frequency assignment for MPSoCs using convex optimization
CODES+ISSS '07 Proceedings of the 5th IEEE/ACM international conference on Hardware/software codesign and system synthesis
Temperature control of high-performance multi-core platforms using convex optimization
Proceedings of the conference on Design, automation and test in Europe
Electro-thermal analysis of multi-fin devices
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
ThermalScope: multi-scale thermal analysis for nanometer-scale integrated circuits
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
A control theory approach for thermal balancing of MPSoC
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Multiscale thermal analysis for nanometer-scale integrated circuits
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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Temperature-related effects are critical in determining both the performance and reliability of VLSI circuits. Accurate and efficient estimation of the temperature distribution corresponding to a specific circuit layout is indispensable in physical design automation tools. In this paper, we propose a highly accurate fast algorithm for computing the on-chip temperature distribution due to power sources located on the top surface of the chip. The method is a combination of several computational techniques including the Green function method, the discrete cosine transform (DCT), and the table look-up technique. The high accuracy of the algorithm comes from the fully analytical nature of the Green function method, and the high efficiency is due to the application of the fast Fourier transform (FFT) technique to compute the DCT and later obtaining the temperature field for any power source distribution using the pre-calculated look-up table. Experimental results have demonstrated that our method has a relative error of below 1% compared with commercial computational fluid dynamic (CFD) softwares for thermal analysis, while the efficiency of our method is orders of magnitude higher than the direct application of the Green function method.