HSpeedEx: a high-speed extractor for substrate noise analysis in complex mixed signal SOC
Proceedings of the 39th annual Design Automation Conference
Comprehensive frequency-dependent substrate noise analysis using boundary element methods
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
Implicit treatment of substrate and power-ground losses in return-limited inductance extraction
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
Analysis and optimization of substrate noise coupling in single-chip RF transceiver design
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
An improved direct boundary element method for substrate coupling resistance extraction
GLSVLSI '05 Proceedings of the 15th ACM Great Lakes symposium on VLSI
A green function-based parasitic extraction method for inhomogeneous substrate layers
Proceedings of the 42nd annual Design Automation Conference
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
Parasitics extraction involving 3-D conductors based on multi-layered Green's function
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Substrate resistance extraction with direct boundary element method
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
A logarithmic full-chip thermal analysis algorithm based on multi-layer Green's function
Proceedings of the conference on Design, automation and test in Europe: Proceedings
Efficient BEM-based substrate network extraction in silicon SoCs
Microelectronics Journal
Contact merging algorithm for efficient substrate noise analysis in large scale circuits
Proceedings of the 19th ACM Great Lakes symposium on VLSI
Accurate temperature estimation using noisy thermal sensors
Proceedings of the 46th Annual Design Automation Conference
Methodology for efficient substrate noise analysis in large-scale mixed-signal circuits
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
On-chip sensor-driven efficient thermal profile estimation algorithms
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Fast Poisson solvers for thermal analysis
Proceedings of the International Conference on Computer-Aided Design
Fast poisson solvers for thermal analysis
ACM Transactions on Design Automation of Electronic Systems (TODAES) - Special section on verification challenges in the concurrent world
Analysis of modeling approaches for on-chip spiral inductors
International Journal of RF and Microwave Computer-Aided Engineering
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The Green function over a multilayer substrate is derived by solving Poisson's equation analytically in the coordinate and numerically in the z and y coordinates. The x and y functional dependence is transformed into a discrete cosine transform (DCT) representation for rapid evaluation. The Green function is further transformed into a numerically stable form appropriate for finite-precision machine evaluation. This Green function is used to solve for the impedance matrix for an arbitrary three-dimensional arrangement of conductors placed anywhere in the substrate. Using this technique, the substrate coupling and loss in IC circuits can be analyzed. A spiral inductor is presented as an example. Experimental measurement results verify the accuracy of the technique