Substrate noise: analysis and optimization for IC design
Substrate noise: analysis and optimization for IC design
Combined BEM/FEM substrate resistance modeling
Proceedings of the 39th annual Design Automation Conference
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Characterizing Substrate Coupling in Deep-Submicron Designs
IEEE Design & Test
Comprehensive frequency-dependent substrate noise analysis using boundary element methods
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
Theoretical and practical validation of combined BEM/FEM substrate resistance modeling
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
Substrate Noise Coupling in Mixed-Signal ASICs
Substrate Noise Coupling in Mixed-Signal ASICs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Efficient techniques for accurate modeling and simulation of substrate coupling in mixed-signal IC's
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Fast Poisson solvers for thermal analysis
Proceedings of the International Conference on Computer-Aided Design
Fast poisson solvers for thermal analysis
ACM Transactions on Design Automation of Electronic Systems (TODAES) - Special section on verification challenges in the concurrent world
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This paper presents a new Green function-based approach for substrate parasitic extraction in substrates with inhomogeneous layers. This new formulation allows analysis of noise coupling with sinkers, trenches and wells, - a limitation in prior Green function-based extractors. Numerical examples for sinkers and trenches are provided and compared with the results from threedimensional semiconductor device simulations. It is shown that the proposed method is accurate and computationally efficient.