Comprehensive frequency-dependent substrate noise analysis using boundary element methods

Authors:
Hongmei Li;Jorge Carballido;Harry H. Yu;Vladimir I. Okhmatovski;Elyse Rosenbaum;Andreas C. Cangellaris
Affiliations:
University of Illinois at Urbana-Champaign, Urbana, IL;University of Illinois at Urbana-Champaign, Urbana, IL;University of Illinois at Urbana-Champaign, Urbana, IL;University of Illinois at Urbana-Champaign, Urbana, IL;University of Illinois at Urbana-Champaign, Urbana, IL;University of Illinois at Urbana-Champaign, Urbana, IL
Venue:
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design
Year:
2002

Citing 12
Cited 3

Resistance extraction using a routing algorithm

DAC '93 Proceedings of the 30th international Design Automation Conference
Boundary element methods for 3D capacitance and substrate resistance calculations in inhomogeneous media in a VLSI layout verification package

Advances in Engineering Software
Efficient thee-dimensional extraction based on static and full-wave layered Green's functions

DAC '98 Proceedings of the 35th annual Design Automation Conference
Fast methods for extraction and sparsification of substrate coupling

Proceedings of the 37th Annual Design Automation Conference
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits

Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Highly accurate fast methods for extraction and sparsification of substrate coupling based on low-rank approximation

Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design
Simulation approaches for strongly coupled interconnect systems

Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design
Layout extraction including substrate parasitics for esd protection circuits and design rule checking

Layout extraction including substrate parasitics for esd protection circuits and design rule checking
Integrated circuit substrate coupling models based on Voronoi tessellation

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
A precorrected-FFT method for electrostatic analysis of complicated 3-D structures

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Numerically stable Green function for modeling and analysis of substrate coupling in integrated circuits

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Modeling digital substrate noise injection in mixed-signal IC's

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

A scalable soft spot analysis methodology for compound noise effects in nano-meter circuits

Proceedings of the 41st annual Design Automation Conference
A green function-based parasitic extraction method for inhomogeneous substrate layers

Proceedings of the 42nd annual Design Automation Conference
Soft-Spot Analysis: Targeting Compound Noise Effects in Nanometer Circuits

IEEE Design & Test

Quantified Score

Hi-index	0.00

Visualization

Abstract

We present a comprehensive methodology for the electrodynamic modeling of substrate noise coupling. A new and efficient method is introduced for the calculation of the Green's function that can accommodate arbitrary substrate doping profiles and thus facilitate substrate noise analysis using boundary element methods. In addition to a discussion of the application of the method and its validation in the context of substrate transfer resistance extraction, preliminary results from its application to frequency-dependent substrate noise modeling are presented also.