Soft-Spot Analysis: Targeting Compound Noise Effects in Nanometer Circuits

  • Authors:
  • Chong Zhao;Sujit Dey;Xiaoliang Bai

  • Affiliations:
  • University of California, San Diego;University of California, San Diego;Cadence Design Systems

  • Venue:
  • IEEE Design & Test
  • Year:
  • 2005

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Abstract

Soft-spot analysis identifies regions in a circuit that are most susceptible to multiple noise sources and their compound effects so that designers can harden those spots for greater robustness. HSpice simulation validates the methodology's quality, and demonstration on a commercial embedded processor shows its scalability.