Efficient techniques for accurate modeling and simulation of substrate coupling in mixed-signal IC's

  • Authors:
  • J. P. Costa;Mike Chou;L. M. Silveira

  • Affiliations:
  • Dept. of Electr. & Comput. Eng., Inst. Superior Tecnico, Lisbon;-;-

  • Venue:
  • IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  • Year:
  • 2006

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Abstract

Industry trends aimed at integrating higher levels of circuit functionality have triggered a proliferation of mixed analog-digital systems. Magnified noise coupling through the common chip substrate has made the design and verification of such systems an increasingly difficult task. In this paper we present a fast eigendecomposition technique that accelerates operator application in BEM methods and avoids the dense-matrix storage while taking all of the substrate boundary effects into account explicitly. This technique can be used for accurate and efficient modeling of substrate coupling effects in mixed-signal integrated circuits