Accurate modeling of substrate resistive coupling for floating substrates

Authors:
Qing Su;Jamil Kawa;Charles Chiang;Yehia Massoud
Affiliations:
Synopsys, Inc., Mountain View, CA;Synopsys, Inc., Mountain View, CA;Synopsys, Inc., Mountain View, CA;Rice University, Houston, TX
Venue:
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Year:
2006

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Abstract

This article focuses on the formulation of the substrate resistive coupling using boundary element methods, specifically for substrates without grounded backplates (floating substrates). An accurate and numerically stable formulation is presented. Numerical results are shown to demonstrate the correctness and the numerical robustness of the formulation.