A matrix synthesis approach to thermal placement
Proceedings of the 1997 international symposium on Physical design
Partition-driven standard cell thermal placement
Proceedings of the 2003 international symposium on Physical design
Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
Temperature-aware global placement
Proceedings of the 2004 Asia and South Pacific Design Automation Conference
A thermal-driven floorplanning algorithm for 3D ICs
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
An efficient and effective detailed placement algorithm
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Thermal-Aware Placement Based on FM Partition Scheme and Force-Directed Heuristic
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
Post-placement temperature reduction techniques
Proceedings of the Conference on Design, Automation and Test in Europe
Thermal Aware Placement in 3D ICs
ARTCOM '10 Proceedings of the 2010 International Conference on Advances in Recent Technologies in Communication and Computing
Minimizing Thermal Disparities during Placement in 3D ICs
CSE '10 Proceedings of the 2010 13th IEEE International Conference on Computational Science and Engineering
Full-chip thermal analysis for the early design stage via generalized integral transforms
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Cell-level placement for improving substrate thermal distribution
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
High-Efficiency Green Function-Based Thermal Simulation Algorithms
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
VLSI legalization with minimum perturbation by iterative augmentation
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
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In this paper, we propose a power density mitigation algorithm at post-placement stage. Our proposed framework first identifies cluster of bins with high temperature, then propagates power density away from high temperature region by balancing regional power density. The problem of balancing regional power density is modeled as a supply-demand problem and solution is obtained with minimal displacement of cells. An analytical temperature profiling algorithm is tightly integrated within the framework to constantly update the temperature profile in response to incremental perturbation to placement. Our proposed approach can effectively reduce maximum temperature compared to previous works on temperature mitigation.