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DAC '98 Proceedings of the 35th annual Design Automation Conference
Electrothermal analysis of VLSI systems
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Proceedings of the 39th annual Design Automation Conference
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Proceedings of the 42nd annual Design Automation Conference
Proceedings of the 42nd annual Design Automation Conference
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Proceedings of the 44th annual Design Automation Conference
Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design
Recent thermal management techniques for microprocessors
ACM Computing Surveys (CSUR)
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Proceedings of the 49th Annual Design Automation Conference
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Proceedings of the Conference on Design, Automation and Test in Europe
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This paper describes a deterministic placement method for standard cells which minimizes total power consumption and leads to a smooth temperature distribution over the die. It is based on the Quadratic Placement formulation, where the overall weighted net length is minimized. Two innovations are introduced to achieve the above goals. First, overall power consumption is minimized by shortening nets with a high power dissipation. Second, cells are spread over the placement area such that the die temperature profile inside the package is flattened.Experimental results show a significant reduction of the maximum temperature on the die and a reduction of total power consumption.