A matrix synthesis approach to thermal placement

Standard cell placement for even on-chip thermal distribution

ISPD '99 Proceedings of the 1999 international symposium on Physical design

MCM placement using a realistic thermal model

GLSVLSI '00 Proceedings of the 10th Great Lakes symposium on VLSI

Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach

Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design

Thermal-Aware Floorplanning Using Genetic Algorithms

ISQED '05 Proceedings of the 6th International Symposium on Quality of Electronic Design

Temperature-aware resource allocation and binding in high-level synthesis

Proceedings of the 42nd annual Design Automation Conference

Peak temperature control and leakage reduction during binding in high level synthesis

ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design

Temperature-Aware Voltage Islands Architecting in System-on-Chip Design

ICCD '05 Proceedings of the 2005 International Conference on Computer Design

A thermal-driven floorplanning algorithm for 3D ICs

Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design

Interconnect and Thermal-aware Floorplanning for 3D Microprocessors

ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design

Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration

ACM Transactions on Design Automation of Electronic Systems (TODAES)

Design space exploration for 3D architectures

ACM Journal on Emerging Technologies in Computing Systems (JETC)

Thermal-aware high-level synthesis based on network flow method

CODES+ISSS '06 Proceedings of the 4th international conference on Hardware/software codesign and system synthesis

An electrothermally-aware full-chip substrate temperature gradient evaluation methodology for leakage dominant technologies with implications for power estimation and hot-spot management

Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design

Placement of 3D ICs with thermal and interlayer via considerations

Proceedings of the 44th annual Design Automation Conference

An integrated approach to thermal management in high-level synthesis

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

N-version temperature-aware scheduling and binding

Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design

Three-dimensional Integrated Circuits: Design, EDA, and Architecture

Foundations and Trends in Electronic Design Automation

Temperature-aware floorplanning via geometric programming

Mathematical and Computer Modelling: An International Journal

Full Length Article: 3D thermal-aware floorplanner using a MILP approximation

Microprocessors & Microsystems

3D thermal-aware floorplanner using a MOEA approximation

Integration, the VLSI Journal

Developing Domain-Knowledge Evolutionary Algorithms for Network-on-Chip Application Mapping

Microprocessors & Microsystems

A network-flow based algorithm for power density mitigation at post-placement stage

Proceedings of the Conference on Design, Automation and Test in Europe