A matrix synthesis approach to thermal placement
Proceedings of the 1997 international symposium on Physical design
ISPD '00 Proceedings of the 2000 international symposium on Physical design
Constrained polygon transformations for incremental floorplanning
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Partition-driven standard cell thermal placement
Proceedings of the 2003 international symposium on Physical design
GLS '99 Proceedings of the Ninth Great Lakes Symposium on VLSI
Thermal-Aware Floorplanning Using Genetic Algorithms
ISQED '05 Proceedings of the 6th International Symposium on Quality of Electronic Design
A thermal-driven floorplanning algorithm for 3D ICs
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Optimal redistribution of white space for wire length minimization
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Interconnect and Thermal-aware Floorplanning for 3D Microprocessors
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
A novel thermal optimization flow using incremental floorplanning for 3D ICs
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Thermal-aware floorplanning exploration for 3D multi-core architectures
Proceedings of the 20th symposium on Great lakes symposium on VLSI
Temperature-aware floorplanning via geometric programming
Mathematical and Computer Modelling: An International Journal
Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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One of the most important concerns in 3D technology is heat removal. In this paper we propose a 3D thermal-aware floorplanner. Our contributions include: (1) a novel multi-objective formulation to consider the thermal and performance constraints in the optimization approach; (2) an efficient Mixed Integer Linear Programming (MILP) representation of the floorplanning model; and (3) a smooth integration of the MILP model with an accurate thermal modelling of the architecture. The experimental results for several realistic 3D stacks based on the Niagara system show promising improvements of the main thermal metrics, with a reduced overhead in the wire length of the system.