ICET: a complete chip-level thermal reliability diagnosis tool for CMOS VLSI chips
DAC '96 Proceedings of the 33rd annual Design Automation Conference
A matrix synthesis approach to thermal placement
Proceedings of the 1997 international symposium on Physical design
Generic global placement and floorplanning
DAC '98 Proceedings of the 35th annual Design Automation Conference
Thermal placement for high-performance multichip modules
ICCD '95 Proceedings of the 1995 International Conference on Computer Design: VLSI in Computers and Processors
Integrated circuit substrate coupling models based on Voronoi tessellation
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Timing, energy, and thermal performance of three-dimensional integrated circuits
Proceedings of the 14th ACM Great Lakes symposium on VLSI
Thermal-Aware Floorplanning Using Genetic Algorithms
ISQED '05 Proceedings of the 6th International Symposium on Quality of Electronic Design
Temperature-aware resource allocation and binding in high-level synthesis
Proceedings of the 42nd annual Design Automation Conference
Peak temperature control and leakage reduction during binding in high level synthesis
ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
Thermal-aware high-level synthesis based on network flow method
CODES+ISSS '06 Proceedings of the 4th international conference on Hardware/software codesign and system synthesis
Microarchitecture floorplanning for sub-threshold leakage reduction
Proceedings of the conference on Design, automation and test in Europe
Thermal-aware floorplanning for task migration enabled active sub-threshold leakage reduction
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
A novel thermal optimization flow using incremental floorplanning for 3D ICs
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
An integrated approach to thermal management in high-level synthesis
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
N-version temperature-aware scheduling and binding
Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design
Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs
Proceedings of the 16th Asia and South Pacific Design Automation Conference
Hotspots elimination and temperature flattening in VLSI circuits
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Application-specific temperature reduction systematic methodology for 2d and 3d networks-on-chip
PATMOS'09 Proceedings of the 19th international conference on Integrated Circuit and System Design: power and Timing Modeling, Optimization and Simulation
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