A matrix synthesis approach to thermal placement
Proceedings of the 1997 international symposium on Physical design
ISPD '00 Proceedings of the 2000 international symposium on Physical design
Constrained polygon transformations for incremental floorplanning
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Evolutionary Algorithms for Solving Multi-Objective Problems
Evolutionary Algorithms for Solving Multi-Objective Problems
Partition-driven standard cell thermal placement
Proceedings of the 2003 international symposium on Physical design
GLS '99 Proceedings of the Ninth Great Lakes Symposium on VLSI
Thermal-Aware Floorplanning Using Genetic Algorithms
ISQED '05 Proceedings of the 6th International Symposium on Quality of Electronic Design
A thermal-driven floorplanning algorithm for 3D ICs
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
Optimal redistribution of white space for wire length minimization
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Interconnect and Thermal-aware Floorplanning for 3D Microprocessors
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
3D floorplanning with thermal vias
Proceedings of the conference on Design, automation and test in Europe: Proceedings
A novel thermal optimization flow using incremental floorplanning for 3D ICs
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Adaptive Task Migration Policies for Thermal Control in MPSoCs
ISVLSI '10 Proceedings of the 2010 IEEE Annual Symposium on VLSI
3D Thermal-aware floorplanner for many-core single-chip systems
LATW '11 Proceedings of the 2011 12th Latin American Test Workshop
A fast and elitist multiobjective genetic algorithm: NSGA-II
IEEE Transactions on Evolutionary Computation
A Memetic Algorithm for VLSI Floorplanning
IEEE Transactions on Systems, Man, and Cybernetics, Part B: Cybernetics
Temperature-aware floorplanning via geometric programming
Mathematical and Computer Modelling: An International Journal
Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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Two of the major concerns in 3D stacked technology are heat removal and power density distribution. In our work, we propose a novel 3D thermal-aware floorplanner. Our contributions include:1.A novel multi-objective formulation to consider the thermal and performance constraints in the optimization approach. 2.Two efficient Multi-Objective Evolutionary Algorithm (MOEA) for the representation of the floorplanning model and for the optimization of thermal parameters and wire length. 3.A smooth integration of the MOEA model with an accurate thermal modeling of the architecture. The experimental work is conducted for two realistic many-core single-chip architectures: an homogeneous system resembling INTEL's SCC, and an improved heterogeneous setup. The results show promising improvements of the mean and peak temperature, as well as the thermal gradient, with a reduced overhead in the wire length of the system.