On thermal effects in deep sub-micron VLSI interconnects
Proceedings of the 36th annual ACM/IEEE Design Automation Conference
Electrothermal analysis of VLSI systems
Electrothermal analysis of VLSI systems
Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
Full chip leakage estimation considering power supply and temperature variations
Proceedings of the 2003 international symposium on Low power electronics and design
Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach
Proceedings of the 2003 IEEE/ACM international conference on Computer-aided design
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Cell-level placement for improving substrate thermal distribution
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
The need for a full-chip and package thermal model for thermally optimized IC designs
ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design
Temperature-Dependent Optimization of Cache Leakage Power Dissipation
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Electrothermal analysis and optimization techniques for nanoscale integrated circuits
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
Temperature-aware routing in 3D ICs
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
TAPHS: thermal-aware unified physical-level and high-level synthesis
ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
Thermal Trends in Emerging Technologies
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
Accurate Thermal Analysis Considering Nonlinear Thermal Conductivity
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
A high efficiency full-chip thermal simulation algorithm
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Adaptive chip-package thermal analysis for synthesis and design
Proceedings of the conference on Design, automation and test in Europe: Proceedings
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Three-dimensional multiprocessor system-on-chip thermal optimization
CODES+ISSS '07 Proceedings of the 5th IEEE/ACM international conference on Hardware/software codesign and system synthesis
Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design
Closed-loop modeling of power and temperature profiles of FPGAs
Proceedings of the ACM/SIGDA international symposium on Field programmable gate arrays
The road to 3D EDA tool readiness
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design
Accurate temperature estimation using noisy thermal sensors
Proceedings of the 46th Annual Design Automation Conference
Thermal analysis and modeling of embedded processors
Computers and Electrical Engineering
On-chip sensor-driven efficient thermal profile estimation algorithms
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Hotspot: acompact thermal modeling methodology for early-stage VLSI design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Proceedings of the 38th annual international symposium on Computer architecture
Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs
Proceedings of the 17th IEEE/ACM international symposium on Low-power electronics and design
3D-ICE: fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Proceedings of the International Conference on Computer-Aided Design
Fast Poisson solvers for thermal analysis
Proceedings of the International Conference on Computer-Aided Design
Fast poisson solvers for thermal analysis
ACM Transactions on Design Automation of Electronic Systems (TODAES) - Special section on verification challenges in the concurrent world
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The ever-increasing power consumption and packaging density of integrated systems creates on-chip temperatures and gradients that can have a substantial impact on performance and reliability. While it is conceptually understood that a thermal equivalent circuit can be constructed to characterize the temperature gradients across the chip, direct and iterative solutions of the corresponding 3D equations are often intractable for a full-chip analysis. Multigrid accelerated iterative methods can be applied to solve the equivalent circuit problem that is provably symmetric positive definite; however, explicitly building the matrix problem is intractable for most full-chip problems. In This work we present a multigrid iterative approach for the full-chip thermal analysis which does not require explicit construction of the equivalent circuit matrix. We propose specific multigrid treatments to cope with the strong anisotropy of the full-chip thermal problem that is created by the vast difference in material thermal properties and chip geometries. Importantly, we demonstrate that only with careful thermal modeling assumptions and appropriate choices for grid hierarchy, multigrid operators and smoothing steps across grid points, can we accurately and efficiently analyze a full-chip thermal problem. Experimental results demonstrate the efficacy of the proposed multigrid methodology. Our prototyped thermal simulator is able to solve a steady-state problem with more than 10 million unknowns in 125 CPU seconds with a peak memory usage of 231 mega bytes.