GEMMW: a portable level 3 BLAS Winograd variant of Strassen's matrix-matrix multiply algorithm
Journal of Computational Physics
Applied Numerical Methods for Engineers and Scientists
Applied Numerical Methods for Engineers and Scientists
Temperature-aware microarchitecture
Proceedings of the 30th annual international symposium on Computer architecture
ISQED '04 Proceedings of the 5th International Symposium on Quality Electronic Design
The Impact of Technology Scaling on Lifetime Reliability
DSN '04 Proceedings of the 2004 International Conference on Dependable Systems and Networks
Temperature-Dependent Optimization of Cache Leakage Power Dissipation
ICCD '05 Proceedings of the 2005 International Conference on Computer Design
Efficient full-chip thermal modeling and analysis
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
A high efficiency full-chip thermal simulation algorithm
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Fast thermal simulation for architecture level dynamic thermal management
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Adaptive chip-package thermal analysis for synthesis and design
Proceedings of the conference on Design, automation and test in Europe: Proceedings
On-chip sensor-driven efficient thermal profile estimation algorithms
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Adaptive and autonomous thermal tracking for high performance computing systems
Proceedings of the 47th Design Automation Conference
Power-efficient variation-aware photonic on-chip network management
Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design
Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Fast thermal analysis on GPU for 3D-ICs with integrated microchannel cooling
Proceedings of the International Conference on Computer-Aided Design
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Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC thermal analysis suffer performance or accuracy problems that prevent use in IC synthesis and hinder use in architectural design. This article describes ISAC, a novel, fast, accurate thermal analysis system for use in IC synthesis and design. We present new, cooperative, temporal and spatial adaptation methods to dramatically accelerate accurate analysis. The proposed system unifies steady-state, time-domain, and frequency-domain analysis techniques. It is composed of our spatially-adaptive multigrid iterative solver, a new temporally and spatially adaptive asynchronous time marching solver, and a new spatially-adaptive frequency-domain moment matching solver. Together, these cooperative adaptation and multi-domain analysis techniques allow the proposed system to efficiently solve the static, short time scale, and long time scale variants of the IC thermal analysis problem. Experimental results demonstrate significant performance improvement over existing thermal analysis solutions. Our spatial adaptation techniques bring a 21.6x -690.0x speedup over recently-published steady-state thermal analysis techniques. Our unified spatial and temporal adaptation techniques, within our asynchronous time marching method, bring a 1,071x -1,890x speedup over other widely-used, time-domain thermal analysis techniques with less than 0.5% error. Our spatial adaptation techniques enable the efficient use of our frequency-domain thermal analysis technique, which brings a 10x -100x speedup over the fastest-known time-domain technique, when used for long time scale thermal analysis. The thermal analysis system described in this article has been implemented as a C/C++ library that has been publicly released for free academic and personal use.