Electrothermal analysis of VLSI systems
Electrothermal analysis of VLSI systems
Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
ThermalScope: multi-scale thermal analysis for nanometer-scale integrated circuits
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Multigrid on GPU: tackling power grid analysis on parallel SIMT platforms
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
A new algorithm for simultaneous gate sizing and threshold voltage assignment
Proceedings of the 2009 international symposium on Physical design
GPU friendly fast Poisson solver for structured power grid network analysis
Proceedings of the 46th Annual Design Automation Conference
GPU-based parallelization for fast circuit optimization
Proceedings of the 46th Annual Design Automation Conference
Thermal modeling for 3D-ICs with integrated microchannel cooling
Proceedings of the 2009 International Conference on Computer-Aided Design
Proceedings of the 2009 International Conference on Computer-Aided Design
Proceedings of the 47th Design Automation Conference
3-D Thermal-ADI: a linear-time chip level transient thermal simulator
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IC thermal simulation and modeling via efficient multigrid-based approaches
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
High-Efficiency Green Function-Based Thermal Simulation Algorithms
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs
Proceedings of the 17th IEEE/ACM international symposium on Low-power electronics and design
A linear-time approach for the transient thermal simulation of liquid-cooled 3d ics
CODES+ISSS '11 Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
GPU programming for EDA with OpenCL
Proceedings of the International Conference on Computer-Aided Design
3D transient thermal solver using non-conformal domain decomposition approach
Proceedings of the International Conference on Computer-Aided Design
Explicit transient thermal simulation of liquid-cooled 3D ICs
Proceedings of the Conference on Design, Automation and Test in Europe
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While effective thermal management for 3D-ICs is becoming increasingly challenging due to the ever increasing power density and chip design complexity, traditional heat sinks are expected to quickly reach their limits for meeting the cooling needs of 3D-ICs. Alternatively, integrated liquid-cooled microchannel heat sink becomes one of the most effective solutions. For the first time, we present fast GPU-based thermal simulation methods for 3D-ICs with integrated microchannel cooling. Based on the physical heat dissipation paths of 3D-ICs with integrated microchannels, we propose novel preconditioned iterative methods that can be efficiently accelerated on GPU's massively parallel computing platforms. Unlike the CPU-based solver development environment in which many existing sophisticated numerical simulation methods (matrix solvers) can be readily adopted and implemented, GPU-based thermal simulation demands more efforts in the algorithm and data structure design phase, and requires careful consideration of GPU's thread/memory organizations, data access/communication patterns, arithmetic intensity, as well as the hardware occupancies. As shown in various experimental results, our GPU-based 3D thermal simulation solvers can achieve up to 360X speedups over the best available direct solvers and more than 35X speedups compared with the CPU-based iterative solvers, without loss of accuracy.