Proceedings of the 37th Annual Design Automation Conference
Full chip leakage estimation considering power supply and temperature variations
Proceedings of the 2003 international symposium on Low power electronics and design
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Efficient full-chip thermal modeling and analysis
Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Interconnect thermal modeling for accurate simulation of circuit timing and reliability
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Temperature-aware processor frequency assignment for MPSoCs using convex optimization
CODES+ISSS '07 Proceedings of the 5th IEEE/ACM international conference on Hardware/software codesign and system synthesis
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The increase in packing density has led to a higher power density in the chip which in turn has led to an increase in temperature on the chip. Temperature affects reliability, performance and power directly, motivating the need to accurately simulate the thermal profile of a chip. In literature, thermal conductivity is assumed to be a constant in order to obtain a linear system of equations which can be solved efficiently. But thermal conductivity is a nonlinear function of temperature and for silicon it varies by 22% over the range 27.80. C [1]. If the nonlinearity of the thermal conductivity is ignored the thermal profile might be off by 10. C. Thus to get an accurate thermal profile it is important to consider the nonlinear dependence of the thermal conductivity on temperature. In this paper the nonlinear system arising out of considering the nonlinear thermal conductivity is solved efficiently using a variant of Newton-Raphson. In this paper we also study the abstraction levels under which the approximation of a periodic source by a DC source is valid.