On thermal effects in deep sub-micron VLSI interconnects

Multiple Si layer ICs: motivation, performance analysis, and design implications

Proceedings of the 37th Annual Design Automation Conference

Analysis and optimization of thermal issues in high-performance VLSI

Proceedings of the 2001 international symposium on Physical design

Thermal-ADI: a linear-time chip-level dynamic thermal simulation algorithm based on alternating-direction-implicit (ADI) method

Proceedings of the 2001 international symposium on Physical design

Analysis of non-uniform temperature-dependent interconnect performance in high performance ICs

Proceedings of the 38th annual Design Automation Conference

Analysis of on-chip inductance effects using a novel performance optimization methodology for distributed RLC interconnects

Proceedings of the 38th annual Design Automation Conference

Estimation of power distribution in VLSI interconnects

ISLPED '01 Proceedings of the 2001 international symposium on Low power electronics and design

Power Supply Design Parameters for Switching-Noise Control in Deep-Submicron Circuits Design Flows

Analog Integrated Circuits and Signal Processing

Analysis of substrate thermal gradient effects on optimal buffer insertion

Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design

Coupled analysis of electromigration reliability and performance in ULSI signal nets

Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design

Compact modeling and SPICE-based simulation for electrothermal analysis of multilevel ULSI interconnects

Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design

Application of combined thermal and electrical simulation for optimization of deep submicron interconnection systems

Microelectronic Engineering

Compact quasi-analytic equations for estimating the temperature distribution of ULSI interconnections

Microelectronic Engineering

3D thermal-ADI: an efficient chip-level transient thermal simulator

Proceedings of the 2003 international symposium on Physical design

Partition-driven standard cell thermal placement

Proceedings of the 2003 international symposium on Physical design

Full-Chip Signal Interconnect Analysis for Electromigration Reliability

ISQED '00 Proceedings of the 1st International Symposium on Quality of Electronic Design

Early Addressing IC and Package Relationship Allows an Overall Better Quality of Complex SOC

ISQED '00 Proceedings of the 1st International Symposium on Quality of Electronic Design

Thermal-ADI: a linear-time chip-level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Thermal and Power Integrity Based Power/Ground Networks Optimization

Proceedings of the conference on Design, automation and test in Europe - Volume 2

An electromigration and thermal model of power wires for a priori high-level reliability prediction

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Scaling Analysis of On-Chip Power Grid Voltage Variations in Nanometer Scale ULSI

Analog Integrated Circuits and Signal Processing

Peak temperature control and leakage reduction during binding in high level synthesis

ISLPED '05 Proceedings of the 2005 international symposium on Low power electronics and design

A thermal-driven floorplanning algorithm for 3D ICs

Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design

Efficient full-chip thermal modeling and analysis

Proceedings of the 2004 IEEE/ACM International conference on Computer-aided design

Electrothermal analysis and optimization techniques for nanoscale integrated circuits

ASP-DAC '06 Proceedings of the 2006 Asia and South Pacific Design Automation Conference

Floorplanning for 3-D VLSI design

Proceedings of the 2005 Asia and South Pacific Design Automation Conference

Critical Path Analysis Considering Temperature, Power Supply Variations and Temperature Induced Leakage

ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design

Thermal resilient bounded-skew clock tree optimization methodology

Proceedings of the conference on Design, automation and test in Europe: Proceedings

Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power

Proceedings of the 2006 international symposium on Low power electronics and design

Thermal-aware high-level synthesis based on network flow method

CODES+ISSS '06 Proceedings of the 4th international conference on Hardware/software codesign and system synthesis

On-Chip Communication Architectures: System on Chip Interconnect

On-Chip Communication Architectures: System on Chip Interconnect

Statistical circuit optimization considering device andinterconnect process variations

Proceedings of the 2007 international workshop on System level interconnect prediction

Minimal skew clock embedding considering time variant temperature gradient

Proceedings of the 2007 international symposium on Physical design

Simultaneous power and thermal integrity driven via stapling in 3D ICs

Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design

Self-heating-aware optimal wire sizing under Elmore delay model

Proceedings of the conference on Design, automation and test in Europe

Collaborative sensing of on-chip wire temperatures using interconnect based ring oscillators

Proceedings of the 18th ACM Great Lakes symposium on VLSI

Three-dimensional Integrated Circuit Design

Three-dimensional Integrated Circuit Design

Dynamic thermal clock skew compensation using tunable delay buffers

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Low-power, process-variation tolerant on-chip thermal monitoring using track and hold based thermal sensors

Proceedings of the 19th ACM Great Lakes symposium on VLSI

Evaluating the effects of temperature gradients and currents nonuniformity in on-chip interconnects

Microelectronics Journal

Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies

Proceedings of the 2009 International Conference on Computer-Aided Design

An intra-chip free-space optical interconnect

Proceedings of the 37th annual international symposium on Computer architecture

An accurate interconnect thermal model using equivalent transmission line circuit

Proceedings of the Conference on Design, Automation and Test in Europe

Thermal-aware clock tree design to increase timing reliability of embedded SoCs

IEEE Transactions on Circuits and Systems Part I: Regular Papers

TABS: temperature-aware layout-driven behavioral synthesis

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Agent-based thermal management using real-time I/O communication relocation for 3D many-cores

PATMOS'11 Proceedings of the 21st international conference on Integrated circuit and system design: power and timing modeling, optimization, and simulation

SPECO: Stochastic Perturbation based Clock tree Optimization considering temperature uncertainty

Integration, the VLSI Journal

Co-tuning of a hybrid electronic-optical network for reducing energy consumption in embedded CMPs

Proceedings of the First International Workshop on Many-core Embedded Systems