Analysis of substrate thermal gradient effects on optimal buffer insertion

Authors:
Amir H. Ajami;Kaustav Banerjee;Massoud Pedram
Affiliations:
Univ. of Southern California, Los Angeles, CA;Stanford University, Stanford, CA;Univ. of Southern California, Los Angeles, CA
Venue:
Proceedings of the 2001 IEEE/ACM international conference on Computer-aided design
Year:
2001

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Abstract

This paper studies the effects of the substrate thermal gradients on the buffer insertion techniques. Using a non-uniform temperature-dependent distributed RC interconnect delay model, the buffer insertion problem is analyzed and design guidelines are provided to ensure the near-optimality of the signal performance in the presence of the thermal gradients. In addition, the effect of temperature-dependent driver resistance on the buffer insertion is studied. Experimental results show that neglecting thermal gradients in the substrate and the interconnect lines can result in non-optimal solutions when using standard buffer insertion techniques and that these effects intensify with technology scaling.