Early Addressing IC and Package Relationship Allows an Overall Better Quality of Complex SOC

Authors:
Anna Fontanelli;Luigi Arnone;Roberto Branca;Giorgio Mastrorocco
Affiliations:
-;-;-;-
Venue:
ISQED '00 Proceedings of the 1st International Symposium on Quality of Electronic Design
Year:
2000

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Abstract

Trends in silicon process and packaging technologies require a tighter integration among manufacturing steps historically well distinct. It is becoming increasingly difficult to design and manufacture the most complex systems-on-a-chip (SOC) without a unified approach, which allows taking into account the package within the integrated circuits (IC) design flow.We present a new methodology, able to convey board-and package-related information into the classical IC design flow and vice versa. This is key to ensure the physical implementation is correct the first time, meeting high-density and high-speed design challenges.ICPack (IC & Package Design Integration) is a flexible and adaptable EDA environment, Java - and Web-based, which aims at reducing the number of iterations required to meet the design objectives in terms of quality, reliability, productivity and time to qualification.