Thermal-ADI: a linear-time chip-level dynamic thermal simulation algorithm based on alternating-direction-implicit (ADI) method

Authors:
Ting-Yuan Wang;Charlie Chung-Ping Chen
Affiliations:
Department of Electrical and Computer Engineering, University of Wisconsin at Madison, Madison, WI;Department of Electrical and Computer Engineering, University of Wisconsin at Madison, Madison, WI
Venue:
Proceedings of the 2001 international symposium on Physical design
Year:
2001

Citing 7
Cited 4

Statistical estimation of average power dissipation in sequential circuits

DAC '97 Proceedings of the 34th annual Design Automation Conference
On thermal effects in deep sub-micron VLSI interconnects

Proceedings of the 36th annual ACM/IEEE Design Automation Conference
Full Chip Thermal Simulation

ISQED '00 Proceedings of the 1st International Symposium on Quality of Electronic Design
iTEM: a temperature-dependent electromigration reliability diagnosis tool

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
ILLIADS-T: an electrothermal timing simulator for temperature-sensitive reliability diagnosis of CMOS VLSI chips

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Interconnect thermal modeling for accurate simulation of circuit timing and reliability

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Cell-level placement for improving substrate thermal distribution

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

3D thermal-ADI: an efficient chip-level transient thermal simulator

Proceedings of the 2003 international symposium on Physical design
Full chip leakage estimation considering power supply and temperature variations

Proceedings of the 2003 international symposium on Low power electronics and design
System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS)

ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Revisiting automated physical synthesis of high-performance clock networks

ACM Transactions on Design Automation of Electronic Systems (TODAES)

Quantified Score

Hi-index	0.00

Visualization

Abstract

Due to the dramatic increase of clock frequency and integration density, power density and on-chip temperature in high-end VLSI circuits rise significantly. To ensure the timing correctness and the reliability of high-end VLSI design, efficient and accurate chip-level transient thermal simulations are of crucial importance.In this paper, we develop and present an efficient transient thermal simulation algorithm based on the alternating-direction-implicit method. Our algorithm, Thermal-ADI, not only hasa linear runtime and memory requirement, but also isunconditionally stablewhich ensures that time-step is not limited by any stability requirement. Extensive experimental results show that our algorithm is not only orders of magnitude faster than the traditional thermal simulation algorithms but also highly accurate, and efficient in memory usage.