On thermal effects in deep sub-micron VLSI interconnects
Proceedings of the 36th annual ACM/IEEE Design Automation Conference
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
Xen and the art of virtualization
SOSP '03 Proceedings of the nineteenth ACM symposium on Operating systems principles
Compact thermal modeling for temperature-aware design
Proceedings of the 41st annual Design Automation Conference
Thermal-driven multilevel routing for 3-D ICs
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
Die Stacking (3D) Microarchitecture
Proceedings of the 39th Annual IEEE/ACM International Symposium on Microarchitecture
Performance Evaluation for Three-Dimensional Networks-On-Chip
ISVLSI '07 Proceedings of the IEEE Computer Society Annual Symposium on VLSI
Microprocessors in the era of terascale integration
Proceedings of the conference on Design, automation and test in Europe
Concurrent Direct Network Access for Virtual Machine Monitors
HPCA '07 Proceedings of the 2007 IEEE 13th International Symposium on High Performance Computer Architecture
Why should we do 3D integration?
Proceedings of the 45th annual Design Automation Conference
Reliable Systems on Unreliable Fabrics
IEEE Design & Test
Challenges and Solutions for Late- and Post-Silicon Design
IEEE Design & Test
Thermal Management for 3D Processors via Task Scheduling
ICPP '08 Proceedings of the 2008 37th International Conference on Parallel Processing
Achieving 10 Gb/s using safe and transparent network interface virtualization
Proceedings of the 2009 ACM SIGPLAN/SIGOPS international conference on Virtual execution environments
ROAdNoC: runtime observability for an adaptive network on chip architecture
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Post-silicon power characterization using thermal infrared emissions
Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design
Taming heterogeneous NIC capabilities for I/O virtualization
WIOV'08 Proceedings of the First conference on I/O virtualization
A network interface card architecture for I/O virtualization in embedded systems
WIOV'10 Proceedings of the 2nd conference on I/O virtualization
Dynamic thermal management in 3D multicore architectures
Proceedings of the Conference on Design, Automation and Test in Europe
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Design and architectures for dependable embedded systems
CODES+ISSS '11 Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
A highly dependable self-adaptive mixed-signal multi-core system-on-chip
ARCS'13 Proceedings of the 26th international conference on Architecture of Computing Systems
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A major concern of current and future on-chip systems is the thermal problem i.e. electrical energy is dissipated leading to high chip temperatures. Short term effects may include transient malfunctioning whereas long-term effects may lead to deteriorating functionality (e.g. increased signal travel times) or to irreversible damage due to, for example, electro-migration. The problem worsens with the inception of 3D architectures as the per-surface dissipated electrical energy is larger, e.g. our evaluation shows an increase of 37.5% in peak temperature in an architecture with 2 layers compared to a single layer architecture. Our proposed concept addresses thermal problems in 3D-stacked many-core architectures resulting from high power densities. A hierarchical agentbased thermal management system initiates a proactive task migration onto cooler processing resources while a communication virtualization layer dynamically adapts and protects connectivity between (migrated) tasks and external I/Os.